国家/地区 中国（5）
IPC部 C（5）
IPC大类 C08（5）
IPC小类 C08K（5）
IPC C08K003/04（5）
发明人 HU B（2）
公开年 2023（5）
申请年 2022（3）  2023（2） 
专利权人

Plug hole resin with low temperature resistance and high thermal conductivity used in circuit board production technology, e.g. deep sea, deep space and polar detection field comprises epoxy resin, reactive diluent, latent curing agent, imidazole curing accelerator, antifoaming agent, and filler.

LI Q, YANG X, JIANG M, ZHANG Z, HE Z, HU B, DENG W, CHEN L

Heat dissipation material used in heat dissipation of heat generating devices, comprises graphene, silver nanoparticles and polyvinylidene fluoride, where graphene vinyl is modified and dispersed in polyvinylidene fluoride, and silver nanoparticles are adsorbed on graphene surface.

HU B, GUO H, LI B

Heat-conducting gel used for heat dissipation of electronic device, comprises silicone oil matrix, bisphenol-A-type epoxy resin and heat-conducting filler comprising modified graphene, modified diamond and modified carbon nanotubes, where surface of modified graphene is modified with amino group.

HE Y, LIU F, YU G

Microporous foam material useful in wave-absorbing material, energy storage material and sensor field, comprises thermoplastic resin, modified graphene plasticizer, lubricant and antioxidant.

HE X, LIU Y, ZHOU J, CHEN P, TAN R, JIANG T

Polypropylene composite material for use in electric automobile batteries with flame retardant and electromagnetic shielding effect, comprises polypropylene, modified expanded graphite, halogen-free flame retardant material, and modified expanded graphite contains flame retardant reinforced material.

TAN C, PENG J, HAN B, LIU S, ZHANG J