国家/地区 台湾（8）
IPC部 C（8）
IPC大类 C08（8）
IPC小类 C08L（8）
IPC C08K003/04（6） H05K009/00（5） C08K003/34（3）
C08L063/00（3） C08L067/04（3） C08L101/00（3）
H05K001/03（3） C08G063/06（2） C08G063/60（2）
C08K007/18（2） C08L009/00（2） H01L023/28（2）
H05K001/09（2）
发明人 JIN R（2） KIM Y S（2）
公开年 2021（4） 2022（4）
申请年 2021（8）
专利权人 TICONA LLC（2）

Composition for forming article e.g. seals, comprises matrix polymer chosen from thermoplastic polymer and curable polymer having functional group for crosslinking, and three-dimensional, branched and/or crosslinked carbon nanostructure additive provided in amount such that after forming article.

REICHL G, GUREVICH E, PERIYASAMY M, QUARTAPELLA C J, PIACENTE N P, LYNN B

Composition used in electronic component for shielding electromagnetic waves, comprises silver particles, resin and alkoxysilane compound.

TAKASHI Y, YONEDA T

Bio-resin composite for bio-foam material comprises a polymer matrix, a toughener, dispersed in the polymer matrix, and an antistatic agent, present at an interface between the polymer matrix and the toughener and/or present in the toughener.

LIOU S, LIU Y, CHENG S, CHANG S, LIAO S

Electroconductive composition used as interconnection material, contains resin component containing functionalized polybutadiene, electroconductive filler, curative, core-shell rubber toughener, epoxy reactive diluents and curing agent.

ESTRUGA ORTIGA M, HENCKENS A, ESTRUGA O M, ESTRUGAORTIGAMARQUE

Resin composition useful in electronic component for communication, comprises molded portion having electromagnetic wave absorber.

UCHIDA K, TSURUMI H, TSURUMI K, NEI T, HIROKAZU T

Resin composition used to form dielectric substrate layer and prepreg used to form printed circuit board, comprises polymeric based material and fillers comprising hollow fillers comprising hollow filler, and material of hollow filler is silicon dioxide.

CHANG C, WU Y, ZHANG C

Electronic device e.g. printed circuit board, comprises singulated carrier portion, substrate molded onto singulated carrier portion, and conductive traces disposed on substrate, where substrate comprises polymer composition that includes aromatic polymer and electrically conductive filler.

KIM Y S, JIN R

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R