国家/地区 中国（7）
IPC部 C（7）
IPC大类 C09（7） C08（4） C25（3）
IPC小类 C09D（7）
IPC C09D011/03（5） C09D011/102（4） C09D011/52（4）
C09D011/107（3） C08G079/00（2） C08J007/044（2）
C08L101/00（2） C09D005/00（2） C09D005/08（2）
C09D185/00（2） C25D005/56（2）
发明人 ZHENG N（7）
公开年 2023（3） 2021（2）
申请年 2022（3）  2021（2） 
专利权人 UNIV XIAMEN（5） TAN KAH KEE .（3） ZEYI FOSHAN .（2）

Conductive ink used for preparing electroplated plastic, comprises water-based resin binder, conductive filler, swelling agent and solvent.

ZHENG N, SUN J, SHAO Z, WU B

Conductive ink used for preparing plastic material, comprises resin binder, conductive filler, pore-forming agent and solvent, where resin binder comprises epoxy resin, polyurethane, alkyd resin, silicone resin, thermosetting acrylic resin and/or thermoplastic acrylic resin.

ZHENG N, SUN J, SHAO Z, WU B

Porous conductive ink used in electroplating pretreatment technology, comprises graphene, conductive particles, binder, hydrophilic oxide, high boiling point solvent and low boiling point solvent.

ZHENG N, SHAO Z, SUN J, WU B

Titanium-based polymer alloy coating for oil well pipe, comprises titanium-based polymer alloy copolymer comprising imide resin, hydroxyl organic titanium polymer, N-methylpyrrolidone, and dimethylacetamide.

YI J, PENG X, ZHANG C, ZHOU J, KUANG Z, TANG S, LI D, ZHENG N, WANG X, WU J, ZHANG W

New hydroxy organotitanium polymer useful for e.g. preparing solvent-free titanium-based polymer alloy marine heavy-duty anticorrosive coating and titanium-based polymer alloy oil tank electrostatic conductive coating.

OUYANG X, ZHANG C, ZHOU J, QI F, TANG S, LI D, LUO S, YI J, ZHENG N, WANG X, ZHONG H, WU J, YE Y, ZHANG S, ZHANG W, LUO H

Preparing graphene far-infrared additive comprises crushing expanded graphite, premixing the carbon material, resin, and additive, adding solvent to the premix, and subjecting the ink precursor dispersion to a stripping process.

ZHENG N, CAO F, WU B

Antioxidant copper-graphene composite conductive ink comprises conductive filler, binder, additive and solvent where conductive filler comprises formate-modified copper material and/or conductive carbon material.

ZHENG N, CAO F, WU B, FANG X, ZHANG X