国家/地区 中国（14）
IPC部 C（14） B（8） H（3）
IPC大类 C21（14） C22（14） B22（6）
B21（5） C01（4） C23（3）
H01（3） C25（2）
IPC小类 C21D（14）
IPC C22F001/08（14）
发明人 GE P（2） GUO D（2） HE W（2）
WANG Q（2） WANG X（2） YANG Z（2）
ZHANG W（2）
公开年 2021（14）
申请年 2021（12）  2020（2） 
专利权人 ANHUI GREEN .（2）

Cathode roller useful in electrolytic copper foil mechanism for preparing electrolytic copper foil, comprises annular base copper foil formed on peripheral wall of roll-shaped main body and is electrically connected to main body, and graphene film formed on surface of copper foil of base material.

WANG E, HE M, YUE X, HUANG Z, DING Z, ZHANG Z, LIU K

Method for preparing high-strength and high-conductivity copper/graphene composite material, involves conducting electrical and thermal conductivity, tensile properties and other tests on rolled clad sheet and heat-treated clad sheet, and comparing and observing microstructures.

YI Y, WANG G, ZHANG S, YU H, ZHANG X, JIANG Q

Preparing high-orientation and high thermal conductivity graphene/copper composite material used as thermal-conducting reinforcing body for electronic device heat power density, comprises e.g. adding isopropanol into ethanol, ultrasonically processing, and forming highly oriented graphene film.

LI L, ZHANG W, DONG L, HUO W, LI X, CHANG G

Ultra-low chromium content copper tungsten-copper chromium integral electrical contact comprises copper tungsten arc resistant end and copper chromium conductive end.

LIU P, YANG R, ZHOU N, ZHAO J, KANG D, ZHOU X

Preparation of graphene copper wire includes ball milling graphene oxide powder and oxygen-free copper powder to obtain mixed powder, hot-press sintering mixed powder, mixing with oxygen-free copper powder to obtain graphene copper sintered body, annealing graphene copper wire and winding.

YANG Z

Preparing nitrogen-doped graphene comprises taking ionic liquid as precursor, spin-coating ionic liquid on the annealed copper foil in argon/hydrogen atmosphere and preparing nitrogen-doped graphene by high-temperature thermal decomposition.

GUAN S, WANG X, LI S, PENG Y

Preparation of copper based iron based composite electrical contact material includes preparing graphene fiber containing ferric oxide powder, modifying graphene fiber containing ferric oxide powder and pretreating base material.

ZHENG Y

Preparation of copper infiltrated wire involves mixing nickel, manganese, iron, zinc, and copper, adding mixture into vacuum melting furnace, molding alloy solution, forging and turning alloy ingots in electric furnace, hot rolling alloy bars into discs, drawing disc, and cutting alloy wire.

ZHOU B, TIAN D, GUO C, SUN J, WANG Q, LIU X, GOU S, LIU Q, LIANG X

High-strength alloy plate comprises nickel, silicon, molybdenum, lithium, magnesium, yttrium, platinum, rhenium, bismuth, tellurium, zirconium, and copper.

GE P, GUO D, HE W

High-conductivity copper alloy plate comprises silver, nickel, tungsten, phosphorus, tantalum, antimony, hafnium, holmium, graphene-coated nano aluminum powder, tin, boron, manganese, cesium, calcium, scandium, and nano copper powder.

GE P, HE W, GUO D