国家/地区 中国（6）
IPC部 C（6）
IPC大类 C25（6）
IPC小类 C25D（6）
IPC C25D003/38（4） C25D005/54（2） C25D007/00（2）
H05K003/42（2） H05K007/20（2）
发明人 ZHANG Z（2）
公开年 2022（3） 2023（3）
申请年 2022（6）
专利权人

Coating solution useful for hole metallization of printed circuit board, comprises edge modified graphene, high molecular polymer, condensing agent, surface energy auxiliary agent, super dispersant, water and pH regulator comprising aqueous ammonia or sodium carbonate solution.

JING W, LI B, LI R, LI F, WU Q, PAN G

Method for preparing high-conductivity nanometer graphene colloid useful in field of printed circuit board involves mixing nano-graphene material with additive, dissolving in water, and performing ball milling and ultrasonic dispersion treatment.

ZHAO Y, CHAI X, HU C, YANG G

Preparing low transmission loss single crystal copper material comprises e.g. forming single crystal copper layer on substrate i.e. graphene layer surface, and peeling off single crystal copper layer from substrate in mixed gas atmosphere of argon and hydrogen.

WANG E, YUE X, HUANG Z, HE M, ZHANG Z, DING Z

Preparation of graphene heat conducting sheet for e.g. reinforcing longitudinal heat flux transmission, involves spraying graphene oxide quantum dots on inner edge surface of prepared annular graphene oxide film, placing in humidity box, compacting and molding, and graphitizing.

KONG X, JIAO Y, ZHANG J, ZHANG Z

Preparing negative charge oxidation graphene, comprises adding concentrated sulfuric acid in reaction container, adding graphite powder, persulfate and phosphorus oxide, and adding concentrated sulfuric acid into graphite solution.

SONG T, CHEN W, PAN Z, LIU Z

Preparing composite copper graphene involves preparing graphene heat conducting film as base material, performing regular perforation process on surface of base material surface, performing electroplating treatment, performing copper deposition on substrate surface and rolling.

LIN Z, CHEN Q, LIANG H, CAI J