国家/地区 中国（7）
IPC部 C（7）
IPC大类 C25（7） H01（6） C01（3）
C23（3） H05（2）
IPC小类 C25D（7）
IPC C25D005/48（7）
发明人 LIN Z（2）
公开年 2023（2）
申请年 2022（3）  2016（2） 
专利权人

Preparing silver-graphite-graphene layer comprises processing the surface of the substrate, pre-plating silver, silver plating, composite plating silver-graphite-graphene, and processing the plated surface.

LIN X, ZHANG Q, CHEN B, GUO W, DING Y, PANG Z, ZHANG C

Polypropylene based composite current collector useful in battery of electric device, comprises polypropylene layer, modified layer and metal layer arranged in stack, where modified layer formed by grafting hydroxy-terminated acrylate and layered double metal hydroxide onto polypropylene layer.

ZHANG G, LI X, XIA J, WANG S, ZHU Z

Preparing composite copper graphene involves preparing graphene heat conducting film as base material, performing regular perforation process on surface of base material surface, performing electroplating treatment, performing copper deposition on substrate surface and rolling.

LIN Z, CHEN Q, LIANG H, CAI J

Preparing high-flexibility graphite material or graphene material radiating component, comprises plasma cleaning graphite, mixing components of activating agent, preparing activating catalyst, washing and drying raw product electroplated with copper layer.

PANG M, PANG M X, MACING F

Production of graphene used in e.g. sensor, involves exfoliating working electrode of electrochemical cell containing aqueous electrolyte comprising exfoliating ions, to produce graphene having specified engineered characteristics.

CHAKI N K, DAS B, DEVARAJAN S, SARKAR S, RAUT R, SINGH B, PANDHER R, KHASELEV O, DIFFARAJAN S, LAUT R, PANDE R, COSERLEF O

Sealing structure for copper column convex point, has copper pillar formed on surface of reduced oxide graphene layer, and metal barrier layer formed on surface of copper pillar, and solder bump formed on surface of metal barrier layer.

LIN Z, TANG H

Flexible substrate processing apparatus used for reducing graphene oxide to form graphene comprises substrate carrying-out portion; reduction treatment portion; washing portion; drying portion; and substrate carrying-in portion.

TAKAHASHI M, SAITO Y, MOMO J, MORIWAKA T, KUSUMOTO N, MORIWAKA K, YONEDA Y