国家/地区 中国（20） 美国（8） 韩国（7） 世界知识产权组织（7） 日本（2） 台湾（2）
IPC部 C（27）
IPC大类 C25（27） C01（10） H01（8）
B82（4） C23（4） B01（2）
C22（2） C30（2） H05（2）
IPC小类 C25D（27）
IPC C25D005/50（27）
发明人 CAO F（2） CHEN Q（2） JO T（2）
JO T J（2） KIDEOK S（2） LEE C（2）
LEE S（2） LEE S H（2） PARK S（2）
SEULKI P（2） SONG K（2） SONG K D（2）
SUNHYOUNG L（2） TAE J J（2） TANG Z（2）
公开年 2021（4） 2022（4） 2013（3） 2015（3） 2017（3） 2023（3） 2016（2） 2018（2） 2020（2）
申请年 2021（5）  2022（5）  2017（4）  2015（3）  2011（2）  2016（2）  2020（2） 
专利权人 ILJIN MATERI.（2） UNIV INJE IN.（2）

Copper foil graphite sheet comprises copper foil, graphene layer continuously deposited on copper foil surface, and nickel-plated layer which is distributed in non-continuous island shape between copper foil and graphene.

CHEN S, CAO F, WANG B

High-strength steel plate comprises base steel plate, and ferrite layer having internal oxide layer on which iron-nickel alloy layer is formed with excellent surface quality formed in internal oxide layer from surface of ferrite layer.

LEE K, LEE C, KANG K, KIM N, JANG Y, LEE J, KANG K C, KIMNAMAH, JANG Y M

Preparing low transmission loss single crystal copper material comprises e.g. forming single crystal copper layer on substrate i.e. graphene layer surface, and peeling off single crystal copper layer from substrate in mixed gas atmosphere of argon and hydrogen.

WANG E, YUE X, HUANG Z, HE M, ZHANG Z, DING Z

Processing high corrosion-resistant stainless steel strip for battery shell, comprises placing stainless steel strip in alkali liquid for ultrasonic cleaning, soaking cleaned stainless steel strip in cleaning solution, heat-treating, naturally cooling, and carrying out surface smoothing treatment.

JIANG X, MAO A, JI Y, DING F, XU W, YU X, YU J, WANG Y, SHAN C, FAN G

Surface treatment for reducing secondary electron yield of oxygen-free copper for e.g. radar, by performing ultrasonic cleaning on oxygen-free copper sheet, performing surface electrolysis treatment in copper sulfate solution, performing electrochemical deposition, and performing heat treatment.

GE Y, FU H, DU Y, PAN P, CAI J, ZHANG H, HAO J

Manufacturing aluminum nitride used as packaging substrate of semiconductors, involves heating electrolyte comprising choline chloride, urea, aluminum chloride, boric acid and ascorbic acid, applying operating current to electroplate aluminum on workpiece, and annealing aluminum on the workpiece.

CHUNG C, LEE C, PENG K, KUNZENG P, LEE C Y, ZHONG Q

Plating of metal bipolar plate includes mixing modified synthetic resin with high conductivity material to obtain coating slurry and applying coating slurry on metal bipolar plate.

YE H

Composite copper foil structure used for copper-clad laminate and printed circuit board, has shell layer comprising N-layer graphene layer and M-layer metal copper layer alternately laminated with each other, and where surface of shell layer close to copper foil core layer is graphene layer.

GAO F, CAI L, ZHANG Q

Method of preparing anode electrophoresis paint mediated electrochemical assembling graphene radiating layer, involves performing thermal reduction treatment to obtain anode electrophoretic paint mediated electrochemical assembling graphene radiating layer.

ZHAO W, JIANG Y, WENG Y, DENG Y

Preparing magnesium alloy conductive coating used in military electronic equipment, involves cutting magnesium alloy block, stir friction processing on magnesium alloy pre-treated surface and preparing electrochemical coating containing polyaniline and graphene on magnesium alloy surface.

YU Z, ZHANG X, ZHENG Y