国家/地区 中国（20） 美国（3）
IPC部 B（24）
IPC大类 C25（24） B82（5） C23（5）
B22（4） C01（4） C22（4）
H01（4） B05（3） B23（3）
B29（3） B32（3） B33（3）
C09（3） B21（2）
IPC小类 C25D（24）
IPC B82Y030/00（4） B82Y040/00（4） C25D005/18（4）
C25D005/48（4） B33Y030/00（3） C25D003/38（3）
C25D005/34（3） C25D005/54（3） C25D007/00（3）
C25D013/02（3） C25D015/00（3） B05D003/02（2）
B29C064/118（2） B29C064/379（2） B32B009/00（2）
发明人 CHEN Y（2） GUO J（2） LIU T（2）
WANG J（2） WU W（2） YANG C（2）
ZHANG Q（2） ZHANG X（2） ZHAO J（2）
公开年 2021（24）
申请年 2021（24）
专利权人 UNIV JILIN（2）

Composite copper foil structure used for copper-clad laminate and printed circuit board, has shell layer comprising N-layer graphene layer and M-layer metal copper layer alternately laminated with each other, and where surface of shell layer close to copper foil core layer is graphene layer.

GAO F, CAI L, ZHANG Q

Blind hole filling using reduced graphene as seed layer comprises pre-processing drilled circuit board, removing glue residue and forming manganese dioxide layer, forming graphene oxide layer on surface of polyaniline layer and reverse pulse electroplating.

XIE H, LUO Z

Coating structure for aging-resistant zinc-nickel alloy silane-free passivation, comprises aluminum alloy substrate, and chemical deposition zinc layer, chemical nickel plating layer, and silane chromium free passivation layer.

CHEN J, GUO C, LAI H

Preparing magnesium alloy conductive coating used in military electronic equipment, involves cutting magnesium alloy block, stir friction processing on magnesium alloy pre-treated surface and preparing electrochemical coating containing polyaniline and graphene on magnesium alloy surface.

YU Z, ZHANG X, ZHENG Y

Preparing nitrogen-substituted graphene/copper oxide photocatalytic film material grown in situ on flexible copper mesh, comprises dissolving sodium hydroxide in deionized water, introducing polyethylenene glycol, and mixing urea and ammonium persulfate.

LI D, GUO W, SUN Y, FENG L, HOU X, ZHANG L, YE X, SUO G, XUE F, LIU J, HE R, YANG Y

Plastic surface electroplating manufacturing method involves mixing polypropylene, polybutadiene, sulfur, sulfenamide accelerant, cobalt salt, and graphene, injection molding, electroplating copper plating layer, heating, keeping temperature, and plating metal plating layer by electroplating.

HU D

Preparing ultra-thin radiating fin used in electronic device, and integrated circuit , involves preparing metal radiating sheet with array pattern on surface of metal foil by nanometre stamping template, and depositing vertical graphene film array on surface.

PAN Z, TAN H

Forming adhesively bonded structure used as building infrastructures, by applying primer compound comprising functionalized nanomaterial dopant to substrate, drying primer compound on substrate, applying adhesive compound over primer layer, contacting adhesive layer with substrate, and curing.

SMITH B A, POTEET S A, PUJAR V V

System used to produce three-dimensional structure, comprises e.g. electrolyte having e.g. growth control solution having suppressor so that when electric potential is applied to working electrode portion of first metal salt in electrolyte reduced and layer of metal deposited outside the region.

HUANG Q

Preparing high toughness layered titanium-based composite material comprises e.g. depositing graphene oxide and silicon powder on titanium foil of cathode, stacking surface co-deposition graphene oxide-silicon coating layer and sintering.

HUO W, LEI C, WU H, LI L, CHANG G, LI X, ZHANG Y