国家/地区 中国（7）
IPC部 B（7）
IPC大类 B05（7）
IPC小类 B05D（7）
IPC C25D007/00（7）
发明人 ZHANG J（2）
公开年 2022（4） 2023（2）
申请年 2021（4）  2022（3） 
专利权人

Forming substrate in substrate hole used in plating technology involves pre-processing surface of insulating base material and hole structure, coating graphene dispersion, applying different rotation radius and different rotating speeds to insulating base and plating material with conductive layer.

XIANG Q, YE G, CAO X, ZHANG J, LU J, MA Y, ZHENG K

Resin-modified coating useful for glove mold, prepared by forming foam layer on the surface of the old aluminum mold through multiple deposition processes, and spraying the modified resin.

SHEN H, DING Z

Preparing superhydrophilic nickel-based multilayer composite membrane material useful in field of photothermal seawater desalination or photothermal sewage purification, comprises e.g. dissolving nickel salt, complexing agent and surfactant in water, and soaking composite structure in salt solution.

MA F, ZENG Z, ZHU L

Multifunctional composite coating of steel structure surface comprises multi-element permeation substrate (zinc powder and aluminum powder), graphene anti-corrosion film (powdered graphene oxide and pyrrole) and fireproof outer layer (flame retardant) provided from inside to outside.

ZHANG H

Preparation of graphene-encapsulated ultra-thin nickel-63 radiation source film used in preparation of Schottky junction stacked radiation cell, involves preparing nickel chloride film, and putting graphene/nickel chloride/graphene film in vacuum environment for reduction treatment.

WANG X, WANG L, CHEN Z, YANG Y, ZHANG J, SU C, FENG H, LI P, WU W, LUO T, ZHOU C

Plating of metal bipolar plate includes mixing modified synthetic resin with high conductivity material to obtain coating slurry and applying coating slurry on metal bipolar plate.

YE H

Blind hole filling using reduced graphene as seed layer comprises pre-processing drilled circuit board, removing glue residue and forming manganese dioxide layer, forming graphene oxide layer on surface of polyaniline layer and reverse pulse electroplating.

XIE H, LUO Z