国家/地区 中国（32） 美国（11） 世界知识产权组织（7） 日本（6） 韩国（6） 欧洲专利局（EPO）（4） 德国（3） 印度（3） 俄罗斯（3） 加拿大（2） 法国（2） 台湾（2）
IPC部 C（42）
IPC大类 C23（42）
IPC小类 C25D（42）
IPC C23C028/00（11） C25D015/00（11） B82Y030/00（8）
C23C028/04（7） C25D003/56（5） C23C018/12（4）
C23C018/32（4） C25D003/38（4） C25D005/10（4）
C25D013/02（4） B82Y040/00（3） C09D005/08（3）
C09D007/62（3） C23C014/02（3） C23C016/02（3）
发明人 GUO C（7） LAI H（7） CHEN Y（4）
CHEN J（3） CHEN M（3） ESAULOV S K（3）
ESAULOVA TS V（3） KUBO T（3） SHIMIZU T（3）
XIA L（3） GABEN F（2） KAWAI H（2）
KAWAI Y（2） OKADA M（2） YE N（2）
公开年 2021（42）
申请年 2021（24）  2020（17） 
专利权人 GUANGZHOU UL.（5） ESAULOV S K（3） ESAULOVA TS .（3） YAZAKI CORP（3）
LBS GUANGZHO.（2）

Composite copper foil structure used for copper-clad laminate and printed circuit board, has shell layer comprising N-layer graphene layer and M-layer metal copper layer alternately laminated with each other, and where surface of shell layer close to copper foil core layer is graphene layer.

GAO F, CAI L, ZHANG Q

High corrosion resistance zinc cobalt alloy coating structure of aluminum alloy piece, has trivalent chromium passivation layer and hydroxyl graphene sealing layer which are prepared in turn from inside to outside of substrate.

CHEN M, LAI H, GUO C

Protective layer structure for chemical nickel plating of aviation electric appliance accessory, comprises aluminum alloy base body, and chemical zinc depositing layer, pre-plating copper layer, and graphene sealing layer.

XIA L, GUO C, LAI H

High corrosion resistant coating structure of galvanized iron alloy of cast iron piece, has silane chromium-free passivation layer that is formed by solvent silane passivation agent.

CHEN J, GUO C, LAI H

Coating structure for aging-resistant zinc-nickel alloy silane-free passivation, comprises aluminum alloy substrate, and chemical deposition zinc layer, chemical nickel plating layer, and silane chromium free passivation layer.

CHEN J, GUO C, LAI H

Preparing high-orientation and high thermal conductivity graphene/copper composite material used as thermal-conducting reinforcing body for electronic device heat power density, comprises e.g. adding isopropanol into ethanol, ultrasonically processing, and forming highly oriented graphene film.

LI L, ZHANG W, DONG L, HUO W, LI X, CHANG G

Electrolytic copper foil oxidation-proof liquid useful in electrolytic copper foil comprises organic polymer, inorganic film-forming auxiliary agent and organic/inorganic acid additive.

CHENG X, WANG Y

Preparing ultra-thin radiating fin used in electronic device, and integrated circuit , involves preparing metal radiating sheet with array pattern on surface of metal foil by nanometre stamping template, and depositing vertical graphene film array on surface.

PAN Z, TAN H

Manufacture of lithium-ion battery used for e.g. phone and laptop, involves e.g. depositing dense layer comprising anode, cathode and/or electrolyte, by supplying substrate and suspension of non-agglomerated nanoparticles of material having preset size, and performing densification of dried layer.

GABEN F

Manufacture of dense layer of electrochemical device, involves providing substrate and suspension of non-agglomerated nanoparticles of material having specific particle size distribution, depositing layer on substrate, drying and densifying.

GABEN F