国家/地区 中国（5） 美国（4） 世界知识产权组织（4） 韩国（3） 日本（2）
IPC部 B（7）
IPC大类 C01（7）
IPC小类 C25D（7）
IPC C25D007/06（7）
发明人 JO T（2） JO T J（2） KIDEOK S（2）
LEE S（2） LEE S H（2） PARK S（2）
SEULKI P（2） SONG K（2） SONG K D（2）
SUNHYOUNG L（2） TAE J J（2）
公开年 2017（4） 2022（2）
申请年 2017（4）  2022（2） 
专利权人 ILJIN MATERI.（2）

Use method of nickel plating on aluminum and aluminum alloy coils, comprises e.g. taking platinum electrode as anode, taking aluminum and aluminum alloy coils as cathode, taking conductive ink as electroplating solution, and then placing in sonicator, heating, sonicating, and electroplating.

CHEN Z

Manufacturing titanium fiber used in e.g. biomedical field, comprises subjecting titanium wire to acid washing, pre-nickel plating, and surface copper plating to obtain copper-plated titanium wire, compounding dried copper-plated titanium wire bundled iron pipe, and spraying modified alumina agent.

OUYANG Q, SHUAI G, WEI S, WU X

Electrolytic copper foil used for producing graphene, has preset ratio of surface roughness of copper foil and surface roughness of copper foil after heat treatment.

JO T J, LEE S H, PARK S, SONG K D, TAE J J, SUNHYOUNG L, SEULKI P, KIDEOK S, JO T, LEE S, SONG K

Electrolytic copper foil used for forming graphene during fabrication of semiconductor component for computer, electronic paper and display, has preset tensile strength before and after subjecting to heat-treatment.

JO T J, LEE S H, PARK S, SONG K D, TAE J J, SUNHYOUNG L, SEULKI P, KIDEOK S, JO T, LEE S, SONG K

Method for manufacturing steel sheet or steel strip for battery case, involves providing nickel-plated steel sheet or strip and applying graphene based coating layer on nickel-plated steel sheet or strip.

SHIVAREDDY S, BOHM S, PATOLE S, THAKUR D B, VAN DER WEIJDE D H, BOEHM S

Production of graphene film used in nanoelectronics, involves forming catalyst film on conductive support, forming graphene film on catalyst film, and electrolytically removing catalyst film from support.

BOTTE G G

Copper foil used for graphene manufacture, consists of copper plating layer containing hydrogen in ratio above preset value, and having glossiness above preset value in rolling parallel direction and right angle direction.

CHIBA Y