国家/地区 中国（6）
IPC部 C（6） H（2）
IPC大类 C25（6）
IPC小类 C25D（6）
IPC C25D005/54（4） C25D003/38（3） C25D007/00（2）
发明人 CAO X（3） LU J（3） MA Y（3）
YE G（3） ZHANG J（3） ZHENG K（3）
公开年 2023（6）
申请年 2021（6）
专利权人 CHINESE ACAD.（3）

Method for modifying bipolar plate surface of hydrogen production by water electrolysis in fuel cell, involves dispersing conductive material in solvent to obtain first solution, obtaining second solution by stirring, and obtaining final bipolar plate with modified coating.

PENG S, SHEN G, LIU Y, ZHANG H, WANG D, LIU G, SHAN D, WANG X

Method for preparing high heat-conductivity graphene film, involves using single-layer or graphene sheet to weave graphene fiber filament, spinning fiber bundle composed of multiple graphene fiber filaments into fiber line, and weaving into graphene grid cloth.

SUN B

Preparing graphene reinforced metal/alloy composite material, involves orienting solution containing graphene and metal ions, keeping spreading state of graphene unchanged, and co-depositing graphene and metal or alloy on cathode plate.

HUANG Y, LANG H, PENG Y

Forming substrate in substrate hole used in plating technology involves pre-processing surface of insulating base material and hole structure, coating graphene dispersion, applying different rotation radius and different rotating speeds to insulating base and plating material with conductive layer.

XIANG Q, YE G, CAO X, ZHANG J, LU J, MA Y, ZHENG K

Strengthening interfacial bonding force of metal and insulating substrate, comprises e.g. pretreating surface and/or pore structure of insulating substrate, coating prepared graphene dispersion liquid on surface and/or pore structure of charge-adjusted insulating substrate, and drying.

CAO X, YE G, LU J, ZHANG J, MA Y, ZHENG K

Graphene/metal composite layer structure useful in item in electroplating process, preferably used for flexible circuit board, comprises interpenetrating network formed by interlocking electroplated metal and graphene surfaces.

YE G, CAO X, ZHANG J, ZHENG K, LU J, MA Y