国家/地区 中国（9）
IPC部 B（9）
IPC大类 C25（9） C23（4） H05（3）
B05（2） B22（2） B82（2）
C22（2）
IPC小类 C25D（9）
IPC C25D005/54（9）
发明人 CHEN W（2）
公开年 2021（3）
申请年 2021（3） 
专利权人

Forming substrate in substrate hole used in plating technology involves pre-processing surface of insulating base material and hole structure, coating graphene dispersion, applying different rotation radius and different rotating speeds to insulating base and plating material with conductive layer.

XIANG Q, YE G, CAO X, ZHANG J, LU J, MA Y, ZHENG K

Preparing composite copper graphene involves preparing graphene heat conducting film as base material, performing regular perforation process on surface of base material surface, performing electroplating treatment, performing copper deposition on substrate surface and rolling.

LIN Z, CHEN Q, LIANG H, CAI J

Composite copper foil structure used for copper-clad laminate and printed circuit board, has shell layer comprising N-layer graphene layer and M-layer metal copper layer alternately laminated with each other, and where surface of shell layer close to copper foil core layer is graphene layer.

GAO F, CAI L, ZHANG Q

Composite material comprises copper matrix and graphene and carbon nanotubes oriented distributed in the copper matrix.

YANG M, LI T, LIU W, WANG Y, HOU H

Preparation of graphene-enhanced nickel-based nanocomposite powder metallurgy material involves cutting graphite into sheet, nano grinding to obtain nano graphene, adding dispersant, putting into centrifuge, and mixing and blending.

OU B, XU C, WANG Q, XIONG L

Graphene heat dissipation coating comprises electrically treating graphene, silicon oxide nanofiber material and nano copper particles, nano copper particles are deposited by electrodeposition in composite material formed.

CHEN W, ZHOU M

Graphene metal solution useful as backing conductive layer for metallization of non-metallic surfaces, comprises graphene or graphene oxide, film forming agent, dispersing agent, anionic surfactant, pH adjuster and water.

CHEN W

Cathode material for e.g. electrocatalytic reduction of oxygen, comprises partially-reduced graphene oxide is supported on surface of carbon paper and platinum supported on partially-reduced graphene oxide surface.

HE H, ZHANG B, ZHANG C, WANG S

Resin plating comprises forming a graphene thin layer on a resin substrate and electroplating the resin substrate having the graphene thin layer formed on it.

BAE A H, SON S I, NAM J D, LEE J H, HWANG T S, OH J S, LEE H, EAH H B, SANG I S, JAE D N, JOON S O, JUN H L, TAE S H, HWANG T, LEE J, NAN J, PAE A, SUN S, OU J