国家/地区 中国（8）
IPC部 B（8）
IPC大类 B29（8）
IPC小类 C25D（8）
IPC C25D005/56（3） C25D015/00（3） B29C045/14（2）
B29C064/118（2） B29C064/379（2） B33Y030/00（2）
B33Y040/20（2） C25D003/12（2） C25D003/38（2）
C25D005/02（2）
发明人 GUO J（2） LIU T（2） WANG J（2）
WU W（2） ZHAO J（2）
公开年 2021（3） 2022（3）
申请年 2021（3）  2022（3） 
专利权人 UNIV JILIN（2）

Composite current collector for use in lithium battery field, has electroplating copper layer arranged on two sides of conductive polymer substrate layer, where conductive polymer substrate layer is provided conductive material and polymer substrate.

JIAO X, WANG R, LIU Z, YAN C

Preparing microfluidic chip through nickel composite power casting core by vacuum coating and gold-spraying conduction treating silicon female mold, placing in composite electroform liquid, electroforming, cleaning, and injection molding.

JIANG B, QIANG J, SUN H, WANG Y, WENG C

Segmented annular wire saw for cutting e.g. crystal silicon, has annular bus, where external surface annular bus is interval with multiple sand plating sections, and chip discharging groove formed between adjacent two sand plating sections.

YOU L, ZHANG Y, GONG Y

Plastic surface electroplating manufacturing method involves mixing polypropylene, polybutadiene, sulfur, sulfenamide accelerant, cobalt salt, and graphene, injection molding, electroplating copper plating layer, heating, keeping temperature, and plating metal plating layer by electroplating.

HU D

Device useful for three-dimensionally printing flexible electronic component based on electro-deposition and double-nozzle, comprises electrolyte circulating channel and distilled water circulation channel connected with deposition chamber.

WU W, WANG J, GUO J, LIU T, ZHAO J

Electronic component three-dimensional (3D) printing device based on selective electro-deposition comprises x-axis moving device, y-axis moving device, and z-axis moving device which are all mounted on mounting support.

WU W, WANG J, GUO J, LIU T, ZHAO J

Corrosion-resistant coating for injection mold, comprises corrosion-resistant layer formed by electrodeposition on mold base, and wear-resistant function layer formed on corrosion-resistant bonding layer as nickel oxide and graphene coating.

CHEN J

Composite film used for packaging organic light emitting diode comprises base film, polydiallyldimethylammonium chloride layer, graphene oxide layer and self-assembling mono-molecular layer.

FENG X, LIU J, QIU Y, WEI X