国家/地区 中国（8） 美国（4） 韩国（2） 台湾（2）
IPC部 C（8）
IPC大类 C08（8）
IPC小类 C09D（8） C08K（5） C08G（4）
C08L（4） C08J（2）
IPC C09D163/00（8）
发明人 LI W（2） LIU W（2）
公开年 2015（8）
申请年 2014（4）  2015（4） 
专利权人

Preparing modified graphene electrically conductive anticorrosive paint involves reacting graphene oxide with concentrated aqueous ammonia under stirring, filtering, washing and drying under vacuum to obtain amine-based graphene powder.

LIU G, LIU Z, LI D, LIU W, ZHOU J, HU X

High flame retardant corrosion-resistant powder coating includes epoxy resin, unsaturated polyester resin, thermoplastic styrene-butadiene rubber, zirconia, nano-clay, red iron oxide, talc, graphene, titanium dioxide and diphenylsilanediol.

QIU H

Polymer and graphene blended electroactive composite coating material for electronic applications is formed by blending specific polymer and graphene.

YEH J, CHANG K, HSU C, JI W, LU H, CHANG C, LI W, CHUANG T, LIU W, TSAI M, XU J, ZHANG G, YE R, YEH J M, CHANG K C, HSU C H, JI W F

Coating composition for coated structure comprises binder system e.g. epoxy-based and/or silicate-based, zinc particles, microspheres, and conductive pigment e.g. graphite, carbon black, graphene, aluminum, black iron oxide, and/or mica.

CAMPS M B, PAULSEN A L, BARGALLO J P, VOSTRACKA T, VOSTRACKAI T, BARGALLO Y P

Graphene composite coating layer for coating target object surface comprises curable mixed resin consisting of curable resin and curing agent and surface-modified nano graphene sheets which are evenly spread in curable mixed resin.

WU M Y, HSIEH C, SHUI C, WU Y, XIE C, HSIEH C Y, SHUI C K

Graphene modifying agent used for radiation-proof protective film, comprises organic solvent, X substituted-2-epoxy butane and/or its organic derivative, and R substituted benzophenone and/or its organic derivative.

XIE S, WANG C, DENG C, LI X, SU W

Polymer/graphene antistatic coating used for preparing antistatic film comprises graphene, electric conductive additive, polymer and solvent.

CHEN M, GUO Y, LI Q, LIU C, LIU L, LI W, QIU S

Molding composition for a semiconductor package comprises a liquid crystal thermosetting polymer resin and graphene oxide.

JI S Y, KIM S H, CHI S, KIM S