国家/地区 中国（14） 韩国（4） 世界知识产权组织（4） 欧洲专利局（EPO）（2） 日本（2） 美国（2）
IPC部 C（16）
IPC大类 C25（16）
IPC小类 C25D（16） C01B（4） C23C（4）
C22C（2） C22F（2） C25B（2）
H01L（2） H01M（2） H05K（2）
IPC C25D003/38（16）
发明人 GUO C（3） LAI H（3）
公开年 2021（16）
申请年 2021（14）  2020（2） 
专利权人 GUANGZHOU UL.（2）

Composite copper foil structure used for copper-clad laminate and printed circuit board, has shell layer comprising N-layer graphene layer and M-layer metal copper layer alternately laminated with each other, and where surface of shell layer close to copper foil core layer is graphene layer.

GAO F, CAI L, ZHANG Q

High corrosion resistance zinc cobalt alloy coating structure of aluminum alloy piece, has trivalent chromium passivation layer and hydroxyl graphene sealing layer which are prepared in turn from inside to outside of substrate.

CHEN M, LAI H, GUO C

Protective layer structure for chemical nickel plating of aviation electric appliance accessory, comprises aluminum alloy base body, and chemical zinc depositing layer, pre-plating copper layer, and graphene sealing layer.

XIA L, GUO C, LAI H

Preparing electrolyte solution for electrodeposition, comprises dispersing nanoparticles in aqueous solution comprising surfactant, thus forming dispersion of nanoparticle-surfactant micellar complexes in solution, and adding electrolytes.

ZHANG N, FANG F, ZHANG H

Protective layer structure of pearl copper coating coated with hydroxyl graphene electrophoretic paint, comprises steel base body from inside to outside orderly preparing watt nickel plating layer.

CHEN J, GUO C, LAI H

Preparing high-flexibility graphite material or graphene material radiating component, comprises plasma cleaning graphite, mixing components of activating agent, preparing activating catalyst, washing and drying raw product electroplated with copper layer.

PANG M, PANG M X, MACING F

Manufacturing copper foil useful in electric circuit of electronic product i.e. mobile devices comprise synthesizing carbon material oxide by heat-treating carbon material in oxygen atmosphere, forming plating solution, and surface-treating.

KIMMINHO, CHOI Y W

Preparing graphene/copper composite powder for composite material for e.g. heat sink material, by mixing acidic solution containing copper ions and aqueous graphene solution or mixing acidic solution containing copper ions and aqueous graphene oxide solution, electro-depositing, and collecting.

WANG L, YU J, ZONG Y

Preparing bright high-conductivity graphene/copper complex material comprises e.g. preparing graphene/copper deposition liquid, adding gelatin and sodium dodecyl sulfate as additive, adding polyacrylamide and thiourea, and depositing.

WEI K, WANG S, WEI W, CHU F, DU Q

Producing composite material used for e.g., electrocatalysis by impregnating a two-dimensional (2D)-material based aerogel with impregnation solvent, performing a solvent/water exchange, performing precursor diffusion and passing a current.

YANG W, MOISSINAC F, BARG S, BYUN J J, FRANCIS M, BARGZUELEN, GRADE S