国家/地区 中国（6） 美国（4） 日本（3） 韩国（3） 世界知识产权组织（3） 欧洲专利局（EPO）（2） 法国（2） 印度（2）
IPC部 C（7）
IPC大类 C25（7）
IPC小类 C25D（7） C23C（4） H01L（3）
H01M（3） B01J（2） B22F（2）
B82Y（2） C04B（2） H01B（2）
H01R（2）
IPC C25D015/00（7）
发明人 GABEN F（2） WEI W（2）
公开年 2021（7）
申请年 2020（6） 
专利权人

Manufacture of lithium-ion battery used for e.g. phone and laptop, involves e.g. depositing dense layer comprising anode, cathode and/or electrolyte, by supplying substrate and suspension of non-agglomerated nanoparticles of material having preset size, and performing densification of dried layer.

GABEN F

Manufacture of dense layer of electrochemical device, involves providing substrate and suspension of non-agglomerated nanoparticles of material having specific particle size distribution, depositing layer on substrate, drying and densifying.

GABEN F

Lithium fast charging battery metal foil graphene material manufacturing device comprises frame, bracket, two linear guide rails, lifting plate, supporting rod, motor pressure regulating tail seat, worm wheel box, and elastic pressure gauge.

DU W

Preparing bright high-conductivity graphene/copper complex material comprises e.g. preparing graphene/copper deposition liquid, adding gelatin and sodium dodecyl sulfate as additive, adding polyacrylamide and thiourea, and depositing.

WEI K, WANG S, WEI W, CHU F, DU Q

Doping method involves stacking sacrificial layer on doped layer, arranging doping material on the sacrificial layer, arranging electrodes on doping material and doped layer, and doping doping material into doped layer.

SON K, KIM T, SON A

Connector e.g. male connector, comprises electrical contact material containing metal base material and conductive coating layer containing phase made of metal other than gold, and phase made of gold or non-metallic conductive material.

KUBO T, OKADA M, SHIMIZU T, KAWAI H, KAWAI Y

Composite plating layer integrated insertion hole assembly for electric connector, has contact spring ring provided with elastic spring claw and plating layer of jack formed with gold-graphene composite plating layer.

ZHOU S, SHEN Y, WEI W, WANG R, LUO H, LIU B, YU G