国家/地区 中国（887）
IPC部 H（887） C（255） B（148）
A（91） G（65） F（58）
E（22） D（14）
IPC大类 H05（887）
IPC小类 H05K（485） H05B（388） C08L（83）
C08K（74） C01B（73） B32B（64）
C08J（53） C09D（38） C09K（36）
H01B（30） H01Q（30） C09J（26）
F24D（22） H01L（22） C04B（21）
IPC H05K007/20（251） H05B003/14（235） H05K009/00（193）
H05B003/02（167） H05B003/20（103） H05B003/34（97）
H05B003/06（64） C08K003/04（61） H05B003/03（49）
B32B009/04（37） B32B009/00（36） H05K005/02（36）
H05K001/02（33） C01B032/194（32） C01B032/184（30）
发明人 ZHANG Y（32） WANG X（27） LI J（23）
YANG Y（23） LIU J（21） WANG J（21）
WANG Z（20） CHEN Y（19） WANG H（19）
WANG Y（19） ZHOU X（18） ZHANG J（17）
LIU Y（16） CHEN J（15） LIU Z（15）
公开年 2022（887）
申请年 2022（434）  2021（403）  2020（50） 
专利权人 ANHUI AEROSP.（11） GUANGDONG MO.（9） SHENZHEN HFC.（7） XZK GRAPHENE.（7）
ANHUI TANHUA.（6） HAIER SMART .（6） HARBIN INST .（6） UNIV SOUTH C.（6）
CHANGZHOU HY.（5） NEW MORE GRA.（5） SHENZHEN LIY.（5） SHENZHEN SEN.（5）
UNIV SICHUAN（5） BEIJING YUAN.（4） CETC NO 33 I.（4） CHAOZHOU XIT.（4）
DONGGUAN HON.（4） QINGDAO HAIE.（4） SHANGHAI XIY.（4） UNIV NORTHWE.（4）

Thermally-conductive epoxy resin circuit board e.g. epoxy resin copper-clad circuit board, comprises epoxy resin insulating layer containing white graphene material.

CHEN M, LIU J, JIANG J

Graphene material for heating device, comprises plastic powder which is polybenzimidazole plastic, and graphene powder and aluminum powder.

WANG H

Mounting structure of graphene chip, has fixing ring whose inner portion is provided with pair of fixing block whose one side far away from each other is fixedly installed with connecting rod whose outer side is sleeved with fixing spring.

LI H

Radiating structure based on thermoelectric cooler (TEC) for use in small power electronic device has graphene assembly provided with heat conducting state propped against radiating upper cover and non-heat conducting state separated from radiating upper cover.

DING Z, FU C, WU J

Anti-bending double-sided circuit board, has circuit board whose left end and right end of circuit board are provided with mounting protective device, where lower parts of left end of device and lower part of right end are provided.

MA Y, LIAO X

Electroplating high density interconnection (HDI) board with high multi-layer blind hole, has four fixing seats that are upper end with fixing screw, and HDI board lower end that is provided with radiating device.

WU W, WU L

Preparing graphene transition metal carbide/polystyrene composite material used in electromagnetic interference shielding, involves providing transition metal carbide/nitride aqueous dispersion, dispersing cationic polystyrene resin microspheres in water, adding aminated dispersion graphene.

ZENG S, HUANG Z, WANG G, ZENG J, LIU J

Flexible water-washing graphene heating sheet comprises graphene heat generating layer, where inner wall of bottom of graphene is fixedly provided with electrode wire, and bottom of the graphene layer is provided with insulating film.

DONG L

Method for preparing metal-graphene composite material by using electronic component, involves preparing metal-graphene composite material by hot-pressing sintering, and applying pulse current to metal substrate to perform surface heat treatment to metal substrate.

WANG X, HUO Y, LI J, CAO Z, XIAO Z

TF card module for use in solid waste field of crushing and sorting, has locating block whose one side is adjacent to locating block is provided with graphene radiating fin, where radiating graphene is jointed with fin.

LIU B, WANG L, ZHOU H