国家/地区 中国（13） 世界知识产权组织（2）
IPC部 C（15）
IPC大类 C09（15）
IPC小类 C09K（15）
IPC C09K005/14（6） C08K003/04（5） H01M010/613（5）
C09K005/06（4） H01M010/0525（4） H01M010/653（4）
C08J005/18（3） C09K011/02（3） C09K011/65（2）
C09K011/88（2） H05K007/20（2）
发明人 HUANG Z（2） YANG Y（2） ZHENG Z（2）
ZHOU Z（2） ZHU Q（2）
公开年 2023（15）
申请年 2022（15）
专利权人 DONGGUAN HON.（2）

Preparing two-dimensional materials with zero bandgap involves transferring zero-bandgap two-dimensional material to surface of substrate to obtain sample, adding the sample and fluorine-containing polymer into heating container, and made to undergo fluorination.

GAO J, XUE Y, JIANG Y

Heat absorbing composite material useful in lithium-ion battery unit, comprises e.g. first organic material containing acid anhydride group, ester group, isocyanate group, aldehyde group and second organic material containing hydroxy group, carboxy group, and amino group.

ZHENG S, SHANG X, REQUEST N N B P

Quantum dot luminescent layer useful in quantum dot light emitting diode device comprises quantum dot material and host material, quantum dot material including first quantum dot, and host material filled in gap between first quantum dots.

ZHOU L, YANG Y

Preparing high thermal conductivity insulating polyvinyl butyral intermediate film, comprises e.g. adding few-layer graphene and dispersant into solvent, using high-shear equipment to stir, adding hexagonal boron nitride, silane coupling agent hydrolysis liquid, and polyvinyl butyral, and stirring.

BOHM S, XIAO F, LIU S, QIAO S, RONG C, FENG D

Preparing graphene-based thermally conductive/conductive composite material, comprises e.g. pressing open-cell metal foam laminate, annealing pressed foam metal, catalyzing graphene on the surface of the metal foam substrate, removing the metal substrate, and post-processing.

CHENG H, LIU H, MA C, REN W

Preparation of oriented heat conducting sheet used in semiconductor heat dissipating device, involves placing fluid composition in orientation molding device having sleeve barrel, applying circumferential shear force, heat-curing formed multilayer aggregate, and slicing oriented composition block.

REN Z, WANG H, GU Z

Plate-shaped heat sink with heat dissipation coating comprises multiple protruding heat dissipation holes formed in areas other than protrusions of kitchen heating unit and protruding heat dissipation holes are formed at regular intervals.

JUNGHAEIL

Preparing multifunctional nanocellulose solution used to prepare film as e.g. antistatic material includes oxidizing plant fiber and oxidation/enzymolysis of industrial paper pulp fiber, mixing obtained modified fibers with functional component e.g. hemicellulose and carbon nanotube and fibrillating.

WANG W, MAO H, YANG X

Preparing heat intelligent material by mixing agglomerant, heat conducting material, thermal expansion material and solvent, freezing first mixture, impregnating second mixture, curing and obtaining heat intelligent material.

WANG J, YANG Y

Electronic device such as chip, comprises electronic component, heat sink in which surface its is provided with magnetic layer containing permanent magnetic material, and composite thermal-conductive material comprising organic matrix and ferromagnetic particles.

FANG H, XU Y, ZHENG K