国家/地区 中国（4） 韩国（3）
IPC部 C（7）
IPC大类 C09（7） C08（3） C01（2）
H05（2）
IPC小类 C09J（7） C01B（2） C08K（2）
H05K（2）
IPC C09J007/28（7）
发明人 CHOI S（2） KWON H J（2） LI W（2）
SONG J（2） YUMINSOOK（2）
公开年 2023（7）
申请年 2021（3）  2022（3） 
专利权人 PURE MANN IN.（2）

High thermal conductivity electromagnetic shielding material module used for e.g. chip, comprises heat conduction layer, and heat dissipation layer, where heat conduction layer is polymer heat conduction adhesive film, and heat dissipation layer is copper foil, aluminum foil or graphite sheet.

YAN C, LI W, SUN X, ZHAO Z

Porous metal type conductive adhesive film, comprises upper adhesive layer, ultra-thin porous metal layer and lower adhesive layer, and ultra-thin porous metal layer formed between upper adhesive layer and lower adhesive layer.

LI J, LIN Z, GAO J, WANG Y, LI W

Stable graphene composite radiating fin for electronic product, has filling hole whose inner wall is provided with multiple annular grooves, where outer wall of upper part of base plate protruding part is distributed with radiating fins.

HE J, JIANG S

Flexible heat-dissipating adhesive sheet comprises thermally conductive adhesive layer formed on one surface of copper sheet and graphene layer formed on other surface of copper sheet in which graphene and synthetic resin are mixed.

HEE L J, HEE L Y, CHOIJINHO

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K

Heat dissipation graphite sheet useful in producing mobile phones and thin portable products comprise heat dissipation layer containing urethane resin, and expanded graphite particles applied to one surface of graphite layer.

KIMTAEHAN, KWON H J, CHOI S, SHIM Y, SONG J, YUMINSOOK

Preparing high strength adhesive tape, involves mixing an adhesive with conductive medium to prepare adhesive, coating adhesive on release film to form adhesive layer, embedding conductive glass fiber on adhesive layer by flocking machine, adhering conductive base material on adhesive layer.

ZHANG H, QIU J