国家/地区 中国（14） 韩国（3）
IPC部 C（18）
IPC大类 C08（18）
IPC小类 C09J（18） C08K（11） C08G（9）
C08L（7） B32B（4） C08J（4）
B29C（2） C08F（2） H05K（2）
IPC C09J011/04（18）
发明人 LIU Y（2） WU X（2）
公开年 2023（18）
申请年 2022（12）  2021（4）  2023（2） 
专利权人

High-barrier heat-resistant solvent-free polyurethane composite material useful as film lamination in packaging composite field of e.g. daily chemical, comprises e.g. polyurethane prepolymer, graphene modified polyol, polyester polyol, nano-silicon dioxide modified polyether polyol and isocyanate.

HE C, TIAN L, WEN Y

Processing wire-drawing aluminum-plastic composite plate useful in household decoration field, comprises e.g. mixing octafluoropentanol and tetrahydrofuran solution, stirring, mixing hexachlorocyclotriphosphazene, reacting, melting, extruding, molding, adhering adjacent plates and hot pressing.

QIAN C

Preparing high-temperature-resistant flame-retardant expanded polystyrene foam board comprises uniformly mixing and stirring to become main ingredient including melamine resin, and high temperature resistant filler, and pasting the two load-bearing boards on both sides of the composite board.

HE Y, RUAN X

Carbon dioxide-based bi-component polyurethane thermal-conducting adhesive comprises isocyanate terminated double ended polyurethane prepolymer, spherical alumina as thermally conductive filler, polyether polyol, polybutadiene polyol and small molecule polyol.

CAO Y, LIU T, LIN H, ZHANG X

Photothermal conversion anti-corrosion adhesive tape in e.g. outdoor steel structures, comprises transparent protective layer resin including silicone resin, polyurethane resin or fluorocarbon resin, and photoelectric layer material including cadmium telluride or selenium-doped cadmium telluride.

PAN X, YANG H, CHEN F

Cyclic silicon-hydrogen bond-containing crosslinking agent useful in preparing adhesive sealant composition for inductors, comprises gamma-methacryloxypropyltrimethoxysilane, tetramethylcyclotetrasiloxane, graphene oxide, first platinum catalyst and methylbutynol.

WU Z, CAI X, LI F, WU X, ZHOU Q

Hot melt adhesive composition for encapsulating electronic devices, preferably located under bonnet of vehicle or in medical devices comprises at least one aliphatic semi-crystalline copolyamide and at least one thermally conductive filler.

PRENVEILLE T

Thermally-conductive pressure-sensitive adhesive useful in preparing thermally-conductive pressure-sensitive adhesive film, and in power batteries of energy vehicles, comprises epoxy resin composition, acrylate copolymer, thermally-conductive filler, curing agent, and photoinitiator.

JIANG B, ZHANG Z, YU D

Single-component thermally conductive hot-melt polyurethane adhesive useful in electronic products comprises polyester polyol, polyether polyol, heat-conducting medium, flame-retardant medium, isocyanate and additive.

CHEN Z

Electrically conductive solvent cement used for coupling thermoplastic components comprises thermoplastic resin, solvent for dissolving the thermoplastic resin, and electrically conductive material.

LI Q, DAIGNEAULT L, MARTINO F