国家/地区 中国（14）
IPC部 C（14）
IPC大类 C08（14）
IPC小类 C09J（14） C08G（8） C08K（7）
C08L（6） B32B（4） C08J（3）
C08F（2）
IPC C09J011/04（14）
发明人 LIU Y（2） WU X（2）
公开年 2023（14）
申请年 2022（11）  2023（2） 
专利权人

High-barrier heat-resistant solvent-free polyurethane composite material useful as film lamination in packaging composite field of e.g. daily chemical, comprises e.g. polyurethane prepolymer, graphene modified polyol, polyester polyol, nano-silicon dioxide modified polyether polyol and isocyanate.

HE C, TIAN L, WEN Y

Processing wire-drawing aluminum-plastic composite plate useful in household decoration field, comprises e.g. mixing octafluoropentanol and tetrahydrofuran solution, stirring, mixing hexachlorocyclotriphosphazene, reacting, melting, extruding, molding, adhering adjacent plates and hot pressing.

QIAN C

Preparing high-temperature-resistant flame-retardant expanded polystyrene foam board comprises uniformly mixing and stirring to become main ingredient including melamine resin, and high temperature resistant filler, and pasting the two load-bearing boards on both sides of the composite board.

HE Y, RUAN X

Carbon dioxide-based bi-component polyurethane thermal-conducting adhesive comprises isocyanate terminated double ended polyurethane prepolymer, spherical alumina as thermally conductive filler, polyether polyol, polybutadiene polyol and small molecule polyol.

CAO Y, LIU T, LIN H, ZHANG X

Photothermal conversion anti-corrosion adhesive tape in e.g. outdoor steel structures, comprises transparent protective layer resin including silicone resin, polyurethane resin or fluorocarbon resin, and photoelectric layer material including cadmium telluride or selenium-doped cadmium telluride.

PAN X, YANG H, CHEN F

Cyclic silicon-hydrogen bond-containing crosslinking agent useful in preparing adhesive sealant composition for inductors, comprises gamma-methacryloxypropyltrimethoxysilane, tetramethylcyclotetrasiloxane, graphene oxide, first platinum catalyst and methylbutynol.

WU Z, CAI X, LI F, WU X, ZHOU Q

Thermally-conductive pressure-sensitive adhesive useful in preparing thermally-conductive pressure-sensitive adhesive film, and in power batteries of energy vehicles, comprises epoxy resin composition, acrylate copolymer, thermally-conductive filler, curing agent, and photoinitiator.

JIANG B, ZHANG Z, YU D

Single-component thermally conductive hot-melt polyurethane adhesive useful in electronic products comprises polyester polyol, polyether polyol, heat-conducting medium, flame-retardant medium, isocyanate and additive.

CHEN Z

Preparing high-reliability epoxy resin absorbing adhesive film with controllable fluidity by mixing epoxy resin matrix and toughener to compound epoxy resin system, placing epoxy resin system, absorbent, and inorganic filler into resin internal mixer for banbury rough mixing and fine mixing.

GONG Y, LIU J, LI M, LI Y, LV T

Polymer layer derived composition useful in a display device, comprises e.g. polyborondimethylsiloxane, benzoyl peroxide, fumed silica, glass fibers, glass powder, carbon nanotubes, graphene oxide, carbonyl iron, calcium carbonate, zinc oxide, silicone elastomer and polydimethylsiloxane.

HWANG S, LEE J, WU X, KIM J, KIM Y, SHIN H, YU W, YU W R, SHIN H J, SONG K Y, KIM J S, OH H J