国家/地区 美国（7）
IPC部 B（7） C（4） H（2）
IPC大类 B23（7）
IPC小类 B23K（5） C23C（3） H01L（2）
IPC B23K026/0622（2） B23K035/02（2） B23K035/24（2）
发明人
公开年 2023（7）
申请年 2022（7）
专利权人 SAMSUNG ELEC.（2）

Chuck assembly used in semiconductor device fabrication system, comprises chuck base includes lower base and upper base that is on lower base, ceramic plate on upper base, and isolator ring enclosing outer sidewall of lower base.

JUNG U, SHIN M, SUNG D, NA D, KIM D, KIM K, JEONG S, JUNG S H, KIMKYUNGSUN, KIM D W, SUNG D Y, SU S M, JUNGUNGYO

Multi-edge oscillating saw blade for use in oscillating tool, has row of perforations sized and shaped such that portion of distal end between row of cutting teeth and row of perforations nearest distal edge breaks away from blade revealing additional cutting edge.

WILSON M A, WARD W Z

Metal particles used in adhesive paste or solder paste for composite bonding structure for semiconductor device, comprises core including metal and shell on surface of core, where shell comprises metal and nanoparticles.

CHU K, LEE J, JUNGHOON L, CHU K M

Welding electrode used for forming weld metal, comprises solid core wire having iron-based base metal composition, electrically conductive coating includes electrically conducting elements or compounds in addition to or other than copper, and also includes elemental antimony and oxides.

ZHOU Y, FARAH S, RUSSELL D B, SENGUPTA V, NARAYANAN B, VIVEK S, B R D, STEVEN P, YIAN Z, ZHOU Y J

Method for fabricating laser-induced graphene patterning on substrate for creating electrochemical micro supercapacitor, involves scribing desired laser-induced graphene patterning in open ambient air by controlling fluence of laser.

CLAUSSEN J, CHEN B, GOMES C L

Fluid system component used in fluid transport, fluid control, fluid operations has body containing multidimensional shape defined in orthogonal directions and layers stacked along one of directions.

MARYA M, ZOLFAGHARI A, KARUPPOOR S S

Manufacturing additive layer used for making particulate and particulate feedstock, involves receiving particulate at chemical vapor deposition reactor, flowing hydrocarbon gas into CVD reactor, decomposing hydrocarbon gas in CVD reactor, depositing carbonaceous coating on particulate.

SCHMIDT W R, ELWARDANY T I, SHE Y, SHARON J A