国家/地区 中国（20）
IPC部 C（20）
IPC大类 C08（20） C09（20） H01（2）
IPC小类 C08K（20）
IPC C08K003/38（20）
发明人 HUANG X（2） LI S（2） LIU Y（2）
ZENG X（2） ZHANG J（2）
公开年 2022（14） 2023（6）
申请年 2022（20）
专利权人

Preparing high thermal conductivity and low dielectric epoxy composite material used in electronic packaging field, involves preparing polyimide, dispersing polyimide microspheres and low-dimensional thermally conductive insulating fillers in solvent, mixing polyimide microsphere with epoxy resin.

ZHONG R, LIANG J, CAI H, TU S, HU D

Preparing high thermal conductivity insulating polyvinyl butyral intermediate film, comprises e.g. adding few-layer graphene and dispersant into solvent, using high-shear equipment to stir, adding hexagonal boron nitride, silane coupling agent hydrolysis liquid, and polyvinyl butyral, and stirring.

BOHM S, XIAO F, LIU S, QIAO S, RONG C, FENG D

Orientation direction adjustable thermal interface material comprises rubber matrix comprising e.g. silicone rubber, acrylic rubber, polyurethane rubber, natural rubber and/or styrene butadiene rubber, two-dimensional sheet filler and 2,2'-(1,4-phenylene)-bis(4-thiol-1,3,2-dioxybenzaldehyde).

WANG J, ZHANG J, FENG Y, LI J, YE N, LU Y

Self-adhesive heat-conducting silicon gel, comprises raw material as polyethylene glycol, modified heat-conducting filler, dimethyl silicone oil and dimethicone coupling agent.

REN B, ZENG X, ZHANG M, JIN L, LI H, LIU H, CHENG X, WU X

High enthalpy value aqueous heat-conducting phase change material comprises paraffin, melamine, ethanol mixture, aqueous polyurethane resin, polyethylene terephthalate release film and heat conducting filler comprising alumina, boron nitride, aluminum nitride or graphene.

LU Q, ZHANG W, SUN B

Hollow micro-sphere composition heat-conducting covered filler by low-dimensional nano-high heat-conducting material useful in heat-conducting aspect, comprises nano-high heat-conducting material comprising electrostatic interaction, chemical bond action and solvent hydrogen bond interaction.

LIU T, HUANG X

Thermally conductive, electrically insulating film used in electronic products and devices, comprises thermoplastic resin, and thermally conductive filler comprising thermally conductive carbon-based filler, thermally conductive metal oxide or hydroxide filler and thermally conductive ceramic filler.

MENG F

Flexible heat-conducting pad comprises liquid metal, solid heat-conducting filler and polymer, and is prepared by pouring liquid metal int polymer, stirring under air environment, dispersing liquid metal uniformly in polymer, and adding solid heat conducting filler into polymer.

CAO B, ZHANG X

PTFE-based composite material used as high-speed sealing material, comprises PTFE, inorganic lubricating filler which is a two-dimensional material and fibrous filler fiber.

ZHANG H, WANG T, XIE H, LI S

Addition-type organic silicon heat-conducting adhesive masterbatch comprises organic silicon monomer I, organic silicon monomer II, blocking agent, catalyst I and high heat-conducting filler.

HAN Y