国家/地区 中国（7）
IPC部 C（7）
IPC大类 C08（7） C09（4）
IPC小类 C08G（7） C08K（2） C09D（2）
C09J（2）
IPC C08G059/50（7）
发明人
公开年 2017（4） 2018（3）
申请年 2017（7）
专利权人

Epoxy resin curing agent is obtained by reacting cardanol-amine with mixed solution, where mixed solution includes graphene, solvent, and epoxy resin and adhesion to resin matrix and corrosion resistance of epoxy resin are improved.

LUO H

High-temperature-resistant graphite alkenyl mono-component epoxy anti-corrosive coating used for high temperature pipeline includes epoxy resin, toughening agent, graphene, silane coupling agent, dispersant, pigment and dicyandiamide.

MA X

Epoxy resin conductive adhesive useful for electronic packaging, comprises epoxy resin, modified nano copper powder, modified silver nanowire, graphene oxide, polyamine curing agent, diluent and coupling agent.

XU X, YIN X, ZHANG L

Adhesive contains allyl bisphenol A epoxy resin, carboxy-terminated polybutadiene, silicone resin, diaminodiphenylmethane, pyromellitic dianhydride, 2-ethylhexyl glycidyl ether, phenyl glycidyl ether, accelerator, graphene oxide and sulfur.

ZHU L

Preparing multifunctional epoxy resin-based water-soluble sizing agent containing graphene oxide comprises e.g. reacting polyfunctional epoxy resin, amino compound containing alcoholic hydroxy group and diluent and stirring.

DAI S, HAO S, REN Z, XING Y, YANG C

Synthesis of aqueous epoxy high-dispersion system for e.g. preparing ultra-high-strength concrete, involves epoxy reacting hydrophilic polyether segment and macromolecular resin and reacting epoxy curing agent and graphene.

ZHU D, SHEN Z, YANG Y, LI Q, LI W, CHEN T, SUN T

Thermally conductive complex material comprises e.g. graphene enriched at the surface of the thermoplastic micro-particles and the thermoplastic micro-particles is dispersed in resin base, further comprising thermoplastic micro-particles.

LI G, WU D, YANG X, LI B