国家/地区 中国（35）
IPC部 C（35）
IPC大类 C08（35） C09（4） H01（3）
IPC小类 C08G（35）
IPC C08G059/50（35）
发明人 MIAO J（4） WANG Y（4） LI G（3）
LI X（3） LIU S（3） BI C（2）
CHEN L（2） DENG H（2） GUO Q（2）
HUANG B（2） HUANG J（2） LIN W（2）
QIU S（2） XU X（2） YU Z（2）
公开年 2017（9） 2022（8） 2018（4） 2015（3） 2019（3） 2020（2）
申请年 2016（10）  2021（6）  2018（4）  2019（3）  2022（3）  2013（2）  2015（2）  2020（2） 
专利权人 WUXI CHANGAN.（4） GUANGDONG JO.（2） UNIV BEIJING.（2） UNIV SHANGHA.（2）

Epoxy resin composite material with low viscosity and high mechanical strength for preparing high performance epoxy system with low viscosity and high mechanical strength comprises epoxy resin, curing agent, multidimensional composite dispersion liquid and reinforcing agent.

CHENG J, CHEN Y, ZHANG J

Preparation of shape memory epoxy foam composite material for shape memory plugging agent, involves mixing aqueous dispersion of nano particles with epoxy monomer, stirring to form Pickering emulsion and adding curing agent into pickering emulsion, pouring emulsion into mold, heating and curing.

QIN W, GU L, HE S, MA Q, ZHOU D, WU Y, FENG H, LIU L, XING X, LI Z

Modified epoxy resin useful as electric material, electronic material, matrix and coating for building material,.

LV S, LU Z, WU J, LIN J

Modified epoxy resin, comprises epoxy resin, curing agent, graphene oxide grafted with carbon nanotubes, silane coupling agent, initiator, organosilicone and solvent.

ZHU X

Semi-rigid epoxy resin foam material useful in fields of aerospace, military and national defense, automobile industry, biology, electronics and medicine, comprises flexible segment-containing linear epoxy resin.

LIU Y, ZHANG Z, LI X

Epoxy resin composition useful for carbon fiber winding, comprise hydantoin epoxy resin, terpyridine-based epoxy resin, interface binder, reactive diluent, hydrophobic modified nano-filler, latent curing agent, accelerator, and wetting and dispersing agent.

QIU S, DENG H, ZHENG S, HUANG B, LI G, LIN W

Preparing continuous fiber-reinforced thermosetting resin-based composite material having high thermal conductivity, comprises e.g. dispersing epoxy prepolymer, curing agent, catalyst, thermally conductive filler and solvent, impregnating continuous fibers, then hot-pressing.

ZHAO J, LIU S, WANG Z, YUAN Y

Preparation of high heat conducting conductive and flame retardant graphene/epoxy resin composite material by heating low eutectic solvent and antimony trioxide, adding graphene, intermittent ultrasonically treating and adding epoxy resin.

WANG J, TANG Y, HONG M

Composite material useful for fiber winding, comprises bisphenol A type epoxy resin, toughening epoxy resin, wetting agent, active diluent, hydrophobic modified nano filler, coupling agent, antifoaming agent, latent curing agent, accelerator and wetting dispersant.

QIU S, DENG H, ZHENG S, HUANG B, LI G, LIN W

Heat-resistant composite dielectric material comprises epoxy resin as substrate, and benzoxazine additive curing, and boron nitride nano sheet and fluorinated graphene as filler, by stripping hexagonal boron nitride into nano-sheet.

REN J, QIU Y, QING Q, BAO P, XU G