国家/地区 中国（16）
IPC部 C（16）
IPC大类 C08（16） C09（3） H01（3）
IPC小类 C08K（16）
IPC C08K009/10（16）
发明人 TANG B（4） TANG F（4） HUANG Z（3）
公开年 2015（10） 2016（6）
申请年 2015（16）
专利权人 TONGLING SHE.（4） HUANG Z（3）

Preparing luminous polyamide complex material comprises e.g. extruding and granulating e.g. nylon resin, hybrid glass fiber reinforced material, nylon masterbatch and graphene/red fluorescent powder/silicon dioxide complex material.

HUANG Z

Full-wave high band infrared radiation plastic comprises nano zirconium silicate, graphene and resin.

WANG J, GUO J

Preparing luminous polyamide composite material comprises e.g. ultrasonic dispersing graphene with deionized water, yttrium, vanadate to obtain material, and reacting composite material with tetraethyl orthosilicate.

HUANG Z

Preparing polyamide composite material comprises dispersing graphene /kaolin/silicon dioxide composite filler and graphene/calcium carbonate/silicon dioxide composite filler, adding e.g. graphene, extruding and granulating.

HUANG Z

Graphene-based heat conduction silica gel phase change composite material comprises silicon substrate, and heat conduction phase change material, which is dispersed in silicon substrate and contains heat conductive filler.

DING S, LIU Z, ZHOU X, MA J

Preparing silver graphene complex material comprises e.g. purifying graphene and dispersing in hydrochloric acid solution, carrying out ultrasonic dispersion, heating and stirring under magnetic stirrer and cooling the solution.

XIA Y, TAO G

Low-temperature resistant thermally-conductive fluorine rubber material comprises fluorine rubber, ethylene-propylene rubber, fumed silica, kaolin nanoparticles, modified graphene, microencapsulated red phosphorus and dioctyl sebacate.

CHEN X

High-dielectric polyimide composite film for load capacitor, contains vanadium pentoxide, expanded graphite, pyromellitic dianhydride, graphene, ethanol, hydroxyethyl methacrylate, polyvinyl alcohol, water and boric acid solution.

TANG B, TANG F

Capacitor with mixed microcrystalline glass powder loaded graphene comprises polyimide high dielectric composite film including polyacrylonitrile based carbon fiber powder, pyromellitic dianhydride, and 4,4-bis diaminodiphenyl ether.

TANG B, TANG F

High-performance antimony tin oxide powder blended silicone resin-polymethyl methacrylate composite material useful for light-emitting diode packaging, comprises e.g. phenyltrimethoxysilane, divinyltetramethyldisiloxane, silica and graphene.

ZHU Z