国家/地区 中国（29）
IPC部 B（29）
IPC大类 C08（29） B29（11） B32（9）
B33（5） B82（4） C09（3）
B27（2） F16（2）
IPC小类 C08L（29）
IPC C08L063/00（29）
发明人 WANG L（4） DU M（3） HUANG H（3）
LIU J（3） SHI Q（3） WANG J（3）
LI H（2） LI J（2） LI Y（2）
LIU Y（2） WANG B（2） WANG Y（2）
WEI J（2） WU Y（2）
公开年 2021（20） 2022（8）
申请年 2021（29）
专利权人 SICHUAN EM T.（3） ANHUI GLANT .（2）

Flexible polymer heat dissipation sheet comprises matrix resin containing nitrile-butadiene rubber, acrylic resin, epoxy resin, phenoxy resin, urethane resin, and/or silicone resin, graphene particles and dispersing agent.

YOO T H, PARK M W, WOO Y H, HWANG S H, HUANG S, YUN H, PARK M, LIU T

Matter composition comprises epoxy functionalized two-dimensional shaped particles comprising functionalized graphene, clays, and alumina platelets, carbon nanotubes, epoxy resin, and curing agent comprising ionic liquid, and 1-ethyl-3-methylimidazolium dicyanamide.

KALB J, IFTIME G, WEI J, PANDEY R, RAHULPANDY, JUNHUA W, JAMIKALB

Low-expansion coefficient halogen-free resin composition useful in laminate for printed circuit board, comprises e.g. o-cresol formaldehyde epoxy resin, bismaleimide resin, cyanate ester hardener and bisphenol A type 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide hardener.

CHEN K, YU D

High heat conducting graphene magnetic composite material comprises graphene film layer and substrate layer, where preparation raw material of graphene film layer comprises graphene, composite base material and solvent, and substrate layer comprises soft magnetic material and hard magnetic material.

LIN Y, JIANG X, CHEN F, JIANG W, FANG W

Preparing light-emitting diode packaging material for emitting white light under excitation of deep ultraviolet light, involves uniformly mixing blue and yellow nitrogen-doped graphene/carbon quantum dots in epoxy resin solution.

LIN J, WANG L, WU X, DU H, CAI X, WEI X, FAN J, YIN X, ZHANG C, LIN T

Preparation of graphene composite particles with core-shell structure includes mixing graphene in organic solvent, mixing emulsifier in deionized water, adding graphene solution, volatilizing organic solvent, filtering composite particles, washing with deionized water and drying.

YE X, DING D, YE Y, WU H, YIN S, HE E

Preparing halogen-free low-dielectric compatible high-frequency FR4 copper-clad plate comprises using glue components comprising resins, coupling agents, catalysts, fillers and solvents comprising dimethylbenzene and cyclohexanone.

JIANG D, QIN W, FU J, LIU J, ZHENG B, LUAN H, CHEN C, WANG L

Preparing coating material for electric heating and de-icing of airplane, involves obtaining reduced Graphene Oxide based on crystalline flake graphite material, and modifying epoxy resin by using Reduced Graphene Oxide.

HU Y, WEI J, WANG P, ZHANG Y

Honeycomb interlayer wave absorbing material for improving inclined incident wave absorbing performance, comprises a first skin, a wave absorbing aramid fibre honeycomb core, a wave absorbing putty and a second skin.

MENG L, HU D, WANG L, WANG Y, MING P, PENG X

Multi-layer composite notebook computer shell material comprises protective film layers, graphene fiber cloth layers, transition layers, intermediate core layer, graphene fiber cloth layer, and adhesive layers.

XIAO F, WANG R, LIU A, LI H