国家/地区 中国（70）
IPC部 C（70）
IPC大类 C08（70） C09（70） H05（8）
H01（4） B29（3） C01（2）
IPC小类 C08K（70）
IPC C09K005/14（70）
发明人 LI Z（5） HU J（4） LIU W（4）
LIU Y（4） GE X（3） HUANG Y（3）
LI J（3） LI X（3） PAN Z（3）
WANG H（3） WANG X（3） WU W（3）
YANG S（3） ZHANG J（3） ZHANG X（3）
公开年 2022（70）
申请年 2022（41）  2021（24）  2020（5） 
专利权人 CHINA PETROL.（4） HANGZHOU FUX.（4） SINOPEC BEIJ.（4） ANHUI AEROSP.（3）
UNIV EAST CH.（3） UNIV ANHUI（2） UNIV SOUTH C.（2） UNIV ZHONGSH.（2）

Preparation of composite heat-conducting pad involves cutting planar high-thermal conductivity film material into fibers, filling gaps between high-thermal conductivity fibers with organic matter, and slicing obtained composite block in direction perpendicular to high-thermal conductivity fibers.

HUANG K, QIN F, WEI T

Thermally conductive, electrically insulating film used in electronic products and devices, comprises thermoplastic resin, and thermally conductive filler comprising thermally conductive carbon-based filler, thermally conductive metal oxide or hydroxide filler and thermally conductive ceramic filler.

MENG F

Flexible heat-conducting pad comprises liquid metal, solid heat-conducting filler and polymer, and is prepared by pouring liquid metal int polymer, stirring under air environment, dispersing liquid metal uniformly in polymer, and adding solid heat conducting filler into polymer.

CAO B, ZHANG X

Folding, bending and stretching flexible high heat conducting film useful in chips, comprises graphene-based materials, acrylate group, film-forming auxiliary agent and heat-conducting filling material comprising graphene oxide, aluminum nitride or boron nitride or aluminum nitride and boron nitride.

ZHAO L, ZHANG L

Preparing high thermal conductivity insulating silica gel, comprises e.g. coating liquid silica gel on both sides of layer of fluorinated graphene membrane, coating liquid silica gel on another layer of fluorinated graphene membrane and curing.

PAN Z, ZHOU M

Heat-conducting and wave-absorbing integrated flexible material useful in the field of electronics, communications, automobiles, medical appliances, household appliance products, aerospace, security monitoring and navigation.

WU W, YAO Q, WU L, YANG X, TONG G

Addition-type organic silicon heat-conducting adhesive masterbatch comprises organic silicon monomer I, organic silicon monomer II, blocking agent, catalyst I and high heat-conducting filler.

HAN Y

Epoxy resin composite material, has multiple fluorinated graphene films located in epoxy resin base body, where multiple fluorinated graphene films orderly arranged along thickness direction and along length direction of epoxy resin base body.

PAN Z, ZHOU M

Preparing graphene heat conducting foam with good directional arrangement comprises coating graphene oxide slurry on substrate to obtain graphene oxide coating, drying graphene oxide coating, freezing, and carrying out heat treatment.

YANG S, HU J, ZHOU S, LI Z, GE X

Preparing compressible high flexibility high heat capacity phase change heat conducting interface material comprises adding phase change material, olefin block copolymer and plasticizer into the high temperature reaction kettle, stirring and melting, cooling and forming.

ZHAO R, LIU Q, CHENG W