国家/地区 中国（227）
IPC部 C（227）
IPC大类 C22（227） B22（114） H01（54）
C01（37） C23（37） B21（24）
B82（11） C25（9） C21（6）
B32（5） B01（4） C09（4）
B33（3） F16（3） B05（2）
IPC小类 C22C（227）
IPC C22C009/00（227）
发明人 LIU Y（22） ZHANG Y（21） ZHANG X（17）
LI X（15） WANG X（14） WANG Y（13）
LI L（12） LENG J（10） LI M（10）
LI Y（10） LIU S（10） LI J（9）
WANG Z（9） YANG Z（9） LI C（7）
公开年 2021（39） 2022（37） 2018（36） 2016（34） 2020（26） 2017（16） 2023（12） 2019（11） 2015（5） 2013（4） 2014（4） 2012（3）
申请年 2021（47）  2016（34）  2017（31）  2022（28）  2020（24）  2019（21）  2018（16）  2015（13）  2012（6）  2014（4）  2013（2） 
专利权人 UNIV JINAN（12） LIU S（10） HARBIN INST .（6） NORTHWEST IN.（6）
UNIV CENT SO.（6） JX NIPPON MI.（5） NIPPON MININ.（5） NIPPON MININ.（5）
UNIV HENAN S.（5） UNIV KUNMING.（5） XIAN RARE ME.（5） SHAANXI SIRU.（4）
UNIV JIANGXI.（4） UNIV XIAN JI.（4） BEIJING GRAP.（3） GRINM ENG TE.（3）
NINGBO INST .（3） NIPPON MININ.（3） STATE GRID C.（3） UNIV SOUTHWE.（3）

Preparing graphene copper-based composite material, comprises e.g. mixing graphene slurry and copper-based powder, compressing powder to obtain green body, vacuum calcining, subjecting to solution heat treatment and aging heat treatment to obtain graphene copper-based composite material.

WANG X, XIAO Z, CAO Z, LI J

Preparing graphene superconducting copper wire, comprises soaking oxygen-free copper balls in self-adhesive water, adding oxygen-free copper balls coated with self-adhesive, hot-pressing graphene composite copper material and performing drawing forming and annealing treatment.

LI J, CAI M, LI B

Preparing oriented carbon nanotube-graphene/copper composite material for use in aerospace industry, involves placing graphite mold in electromagnetic field, adding dry composite powder slowly to align powder in mold, and solidifying powder by Spark plasma sintering vacuum sintering apparatus.

DU H, LIU S, DENG W, DENG L

Electrical contact functional composite material useful in preparation of high and low voltage switch contact, comprises matrix phase which is dispersed copper formed by dispersion of aluminum oxide on copper matrix, and enhanced phase is molybdenum, silicon carbide and graphene oxide.

LIU Y, LI X, JIA Y, WANG Z, ZHENG X, LI Y, AN J, ZHU H, TIAN B, ZHOU M, ZHANG Y

Preparing graphene-doped copper bonding wire comprises taking graphene oxide, mixing with mixed metal powder to obtain molten mixed powder, placing semi-finished product wire into aqueous solution of reducing agent for heating, annealing, washing and drying.

FENG Z, QU S, LIU B, WANG T, LIN L

Preparing copper-graphene composite material involves utilizing mechanical alloying method to prepare copper and polymer powder to obtain copper-polymer powder, cold isostatic pressing copper polymer powder to get bar melting region to bar porous rod material.

LIANG J, ZHANG X, WANG D, LI X, ZHOU S, GUO G, BAO F

Copper-carbon composite material useful in preparation of conductive product, comprises copper substrate, carbon material and intermediate element capable of alloying with carbon material, carbon material is dispersed between copper grains of copper substrate.

XIAO Y, GONG S, JING X, JIANG Z, YU X, WANG Z

Method for preparing metal-based composite material with enhanced graphene used in electrical and thermal conductivities involves mixing and dispersing graphene and metal powder to obtain reinforced powder, and compounding reinforced powder with metal base material by stirring friction technology.

PEI Z, LIANG J, YANG W, ZHANG X, CHEN Q

Preparing copper rare earth graphene electrical contact material comprises e.g. mixing copper rare earth alloy powder and silicon powder to obtain mixed powder, carrying out chemical vapor deposition, separating silicon powder in mixed powder, sintering, extruding and drawing preform.

CAO H, MA Y

Preparing copper graphene laminated sheet composite material, involves processing copper foil, punching on graphene film, placing graphene foil in the hydrochloric acid solution to remove the copper foil, mixing raw sand, clay and water, and setting sintering program for heating and infiltration.

WANG Y, CUI J, ZHANG Y, MA B, LUO L, WU Y, SI Y, QIN Y