国家/地区 中国（6）
IPC部 B（6）
IPC大类 B32（6） C08（4） C09（3）
H05（2）
IPC小类 B32B（6）
IPC B32B017/02（6）
发明人 CHEN K（2） WANG L（2） YU D（2）
公开年 2022（5）
申请年 2021（6）
专利权人 ITEQ WUXI EL.（2）

Low-expansion coefficient halogen-free resin composition useful in laminate for printed circuit board, comprises e.g. o-cresol formaldehyde epoxy resin, bismaleimide resin, cyanate ester hardener and bisphenol A type 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide hardener.

CHEN K, YU D

Low-expansion coefficient halogen-free resin composition useful in laminate and printed circuit board, comprises e.g. o-cresol epoxy resin, bis(4-maleimidophenyl)methane, polyvalent hydroxy-modified styrene resin, phosphinate and cyanate ester hardener.

CHEN K, YU D

Preparing anti-deformation acrylic sheet with thermal insulation function comprises e.g. preparing acrylic base layer, preparing fiber layer, preparing thermal insulation coating, coating the thermal insulation layer coating on the fiber layer, and drying.

ZHANG X, LIN X, JIA L, WANG J, ZHU X

Continuous fiber bundle reinforced composite material that is used for preparing photovoltaic module backplane material, automobile shell, battery shell, rail transit equipment shell, aircraft portion, comprises strip material layer, and upper film layer and lower film layer.

WU X, CHEN H, CHENG X, HAN X, TANG K, CUI B, HU Q, WANG L, YAN S

Glass fiber cloth reinforced thermosetting copper-clad plate comprises glass fiber cloth, and copper foil bonded with resin adhesive on one or both sides of glass fiber cloth, the resin adhesive is formed by mixing adhesive and flame retardant and surface of copper foil is coated by coating.

CHEN M, WANG L, HE W, ZHAN H

Graphene modified multifunctional glare laminate used in aerospace, comprises glass fiber and graphene modified adhesive, where adding graphene modified adhesive to epoxy resin curing agent, mixing with glass fiber, hot-pressing and curing.

WANG S, CONG F, ZHANG Y, MENG Q, CUI X, WANG Z