国家/地区 中国（8）
IPC部 C（8）
IPC大类 C21（8）
IPC小类 C21D（8）
IPC C21D009/52（8）
发明人
公开年 2021（7）
申请年 2021（6） 
专利权人

Preparing battery steel case coated with metal layer on the surface, comprises e.g. grinding surface of low-carbon steel strip, performing electroplating in nickel-iron plating solution, surface magnetron sputtering of cobalt, and electroplating in nickel-iron-cobalt-phosphorus plating solution.

LI J, ZHOU H

Cathode roller useful in electrolytic copper foil mechanism for preparing electrolytic copper foil, comprises annular base copper foil formed on peripheral wall of roll-shaped main body and is electrically connected to main body, and graphene film formed on surface of copper foil of base material.

WANG E, HE M, YUE X, HUANG Z, DING Z, ZHANG Z, LIU K

Graphene bonded silver wire for packaging, comprises specified amount of graphene and silver.

PENG X, PENG S

Preparation of copper infiltrated wire involves mixing nickel, manganese, iron, zinc, and copper, adding mixture into vacuum melting furnace, molding alloy solution, forging and turning alloy ingots in electric furnace, hot rolling alloy bars into discs, drawing disc, and cutting alloy wire.

ZHOU B, TIAN D, GUO C, SUN J, WANG Q, LIU X, GOU S, LIU Q, LIANG X

High-strength alloy plate comprises nickel, silicon, molybdenum, lithium, magnesium, yttrium, platinum, rhenium, bismuth, tellurium, zirconium, and copper.

GE P, GUO D, HE W

Preparation of graphene-aluminum composite material lead by mixing magnesium oxide and graphene, soaking, liquid nitrogen ball milling, vacuum drying, roasting, adding magnesium oxide and atomized aluminum, casting, stretching and annealing.

JIA T, HONG W, ZHOU R, XI X, YANG F, LI M

Method for reducing resistivity of single crystal copper wire, involves annealing single crystal copper under non-oxidizing gas and protective gas atmosphere, introducing carbon-containing gas into copper wire, reacting and cooling.

NOVOSELOV K

High strength high conductivity graphene-copper composite wire comprises graphene, impurity element and copper.

YANG Z, FENG X, XIE H, PENG L, HUANG G, ZHANG W, MI X