国家/地区 中国（7）
IPC部 C（7）
IPC大类 C25（7） H05（5） H01（3）
IPC小类 C25D（7）
IPC C25D005/56（7）
发明人
公开年 2021（4） 2023（2）
申请年 2021（4）  2022（2） 
专利权人

Strengthening interfacial bonding force of metal and insulating substrate, comprises e.g. pretreating surface and/or pore structure of insulating substrate, coating prepared graphene dispersion liquid on surface and/or pore structure of charge-adjusted insulating substrate, and drying.

CAO X, YE G, LU J, ZHANG J, MA Y, ZHENG K

Preparing composite current collector base film used for preparing composite current collector of lithium battery, involves doping conductive particles containing conductive polymer and/or inorganic particles, and auxiliary agent in polymer matrix as carrier, where formed base film has conductivity.

KUAI Y, FANG Y, XU X, ZHOU G, PAN J, LIANG Y, XU H

Composite current collector for use in lithium battery field, has electroplating copper layer arranged on two sides of conductive polymer substrate layer, where conductive polymer substrate layer is provided conductive material and polymer substrate.

JIAO X, WANG R, LIU Z, YAN C

Radiating net for graphene honeycomb, has honeycomb net base material whose surface is sprayed with graphene coating, and is compounded with conductive material layer by hot melt adhesive and honeycomb net base material that is formed by water-plating and pressing of polyurethane sponge.

CHEN W

Preparing high-flexibility graphite material or graphene material radiating component, comprises plasma cleaning graphite, mixing components of activating agent, preparing activating catalyst, washing and drying raw product electroplated with copper layer.

PANG M, PANG M X, MACING F

Composite processing method for flexibly customizing high adjustable flexible micro-heater, involves using selective electrochemical deposition material to deposit on heating pattern region, and packaging flexible polymer as packaging layer to finish manufacture of flexible microheater.

YANG Y

Preparing flame-retardant omni-directional conductive sponge material comprises placing sponge substrate into pre-soaking liquid, subjecting into electroplating solution, and plating electroplated sponge substrate with conductive cloth.

LIU W