国家/地区 中国（7）
IPC部 C（7）
IPC大类 C25（7） H05（7） H01（2）
IPC小类 C25D（7）
IPC C25D005/54（7）
发明人 CAO X（2） MA Y（2） YE G（2）
ZHANG J（2） ZHENG K（2）
公开年 2021（7）
申请年 2021（4）  2020（3） 
专利权人 CHINESE ACAD.（2）

Composite copper foil structure used for copper-clad laminate and printed circuit board, has shell layer comprising N-layer graphene layer and M-layer metal copper layer alternately laminated with each other, and where surface of shell layer close to copper foil core layer is graphene layer.

GAO F, CAI L, ZHANG Q

Preparing high-flexibility graphite material or graphene material radiating component, comprises plasma cleaning graphite, mixing components of activating agent, preparing activating catalyst, washing and drying raw product electroplated with copper layer.

PANG M, PANG M X, MACING F

Method for treating substrate surface for electroplating flexible circuit board, involves pre-washing surface of substrate to be electroplated, and coating prepared graphene dispersion liquid on pre-washed substrate surface to be electroplated to form conductive layer for direct electroplating.

ZHENG K, CAO X, YE G, ZHANG J, MA Y

Processing substrate hole comprises e.g. pre-washing substrate, soaking pre-washed substrate in prepared graphene dispersion liquid, soaking liquid in hole structure, ultrasonically treating, drying to form conductive layer for direct plating.

CAO X, ZHENG K, YE G, ZHANG J, MA Y

Graphene sheet/carbon black composite black hole liquid useful in printed circuit board, comprises graphene sheet, carbon black, surfactant, aqueous high molecular polymer, potassium hydroxide solution and deionized water.

WANG J, LI Z, CAO L, BAI J, FANG B, HAO L

Preparation of black hole liquid for printed circuit board, involves taking graphite plate, titanium plate or graphite plate, using ultra-pure water or aqueous ammonia as electrolyte, electrolyzing, adding conductive agent and adhesive.

WU Z, XIAO C, MO S, LIN J, SUN Y

Electroplating of metal on surface of insulating base material for printed circuit board, involves mixing resin and solid filler to obtain resin coating, coating conductive substance forming film and placing in plating solution.

LAI Z, LIANG X, ZHAO T, LIU D, SUN R