国家/地区 中国（11）
IPC部 F（11）
IPC大类 F28（11）
IPC小类 F28D（11）
IPC H05K007/20（11）
发明人 CHEN Y（2） HONG Y（2） HORNG A（2）
公开年 2021（7） 2022（3）
申请年 2020（7）  2021（3） 
专利权人 SUNONWEALTH .（2）

Super-large-capacity chemical heat storage material on missile-borne electronic device, comprises hydrated salt, expanded graphite and graphene film, and prepared by melt-blending hydrated salt and expanded graphite and stirring to obtain composite melt, and cooling down to room temperature.

LAN Y, LIU J, YU X, FANG X, ZHANG Z, LING Z

Thin encapsulating mounting structure for evaporation and heat dissipation applications for electronic component, has specific thin film portion whose one surface is fixed to fixing portion, and preset thin film portion, fixing portion and specific thin film portion that are assembled.

LU J, LUGECHI, LU J Q

Preparation method of nano liquid absorbing core for intelligent product or electronic product, involves taking metal core and in situ growing graphene with hydrophilic functional groups on surface of the metal core.

JIA Y, WU Q, MA Y

Carbon-based flexible high thermal conductivity heat transfer mechanism useful for transferring heat from heat source to heat sink e.g. radiator, comprises heat conducting belt body used as fast transmission path of heat and heat conducting belt joint for ensuring minimum contact thermal resistance.

HE Y

Heat exchanger for air conditioner, has heat exchanger main structure whose outer surface is coated with radiating layer, radiating layer that comprises graphene material, and graphene which comprises carbon element and non-carbon element.

WAN K, CHEN W, LIN L

Uniform temperature plate for use in radiating device for radiating electronic component, has protective layer connected to outer surface of heat conducting sheet, where thickness of protective layer is in specific range.

CHEN Y, YEH C, HONG Y, HORNG A

Thin-type uniform temperature plate coated with graphene, has heat absorbing plate and radiating plate that are covered with each other, where side of heat absorbing plate and radiating plate are arranged far away from groove that is sprayed with graphene layer.

CHEN X

Uniform temperature equalizing plate, has chamber filled with working liquid and heat conducting piece, where heat conducting coefficient of heat conducting piece is greater than heat conducting coefficient of first sheet body and second sheet body.

HONG Y, LI M, CHEN Y, HORNG A

Thermal exchange assembly used e.g. in computing platform e.g. laptop, comprises cold plate configured to be placed on semiconductor device and including window section, and heat pipe directly coupled to cold plate and including window.

CARBONE M, HUTTULA J, MISHRA C, PAAVOLA J

Gas and liquid heat exchange anti-corrosion printed circuit board heat exchanger, has heat exchanger core body provided with first heat exchange plate substrate, and fluid flow passage connected between first and second heat exchange plate.

LIN X, YIN L, WANG Q, SU W