国家/地区 日本（6）
IPC部 C（6） B（5） H（3）
IPC大类 C08（6） B32（4） B29（3）
C09（3） H01（3） H05（2）
IPC小类 C08K（6） C08L（6） B32B（4）
B29C（3） H01L（3） C08G（2）
C09D（2） H05K（2）
IPC C08K007/06（6）
发明人 KIM Y S（2）
公开年 2021（6）
申请年 2021（3）  2019（2） 
专利权人

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Milled pitch-based carbon fiber used for forming heat conductive molded article, comprises anisotropic pitch as raw material, where graphene sheet is open when observing fiber end face with transmission electron microscope.

KISHIMOTO H, ARAI Y, TADOKORO H

Preparing directional heat conducting sheet used for semiconductor radiating device, by placing fluid composition in orientation forming device, applying high-speed shear force, orienting filler in composition in shear direction to form thin-layer composition, collecting in mold, curing and slicing.

REN Z, WANG H, REN Z M

Additively manufacturing silicone elastomer article by applying additive manufacturing material on substrate and forming layer by addition-crosslinking electro-conductive silicone composition containing e.g., organopolysiloxane and catalyst.

YUE Y, JIA L

Surface-treatment composition used for vibration damping steel sheet, comprises polymer resin and inorganic nanoparticles having preset average aspect ratio.

KIM J, LEE J, KIM Y, CHOI H, CHOI Y, KIM J T, KIM Y S, CHOI Y H, CUI H, JIN Y, LI Z

Manufacture of substrate for device for shielding electromagnetic radiation, involves providing polymer material and/or precursor comprising conductive filler, and subjecting polymer material and/or precursor to shaping with material bond.

SCHROIFF V, SUTTER M, HAUER M, GRUNE E