国家/地区 台湾（7）
IPC部 B（7）
IPC大类 B23（7）
IPC小类 B23K（5） C01B（4） H01L（3）
B01J（2） C04B（2） C23C（2）
H01B（2）
IPC C01B031/04（2） C01B032/184（2） C01B032/186（2）
C04B035/645（2） C23C016/26（2） C23C016/56（2）
发明人 CHEN W（2）
公开年 2021（4）
申请年 2020（3） 
专利权人 UNIV NAT TAI.（2）

Electrical steel used as strip e.g. steel sheets, comprises functional layer comprising ferromagnetic material and additional layer comprising non-magnetizable material, which are connected by adhesive bond with atomic diffusion.

FRANKEN C, PLATT J

Preparing laser light-induced graphene, comprises providing substrate including polyimide or polyetherimide, and adjusting laser light source and far-infrared auxiliary light source to irradiate substrate.

TSENG S, CAI Y

Composition used for manufacturing composite polycrystalline diamond, comprises diamond particle(s), boron-doped diamond particle(s), and preset amount of additive containing boron oxide powder, and nano-carbon material.

CHEN W, PAN P, SUN Y

Production of electronic device such as integrated circuit board, involves providing substrate, supplying flow comprising precursor compound, selectively laser ablating graphene, and selectively laser ablating surface of substrate.

GLASS H, GUINEY I, TYLER M, WALLIS R, BAINES R, THOMAS S

Semiconductor manufacturing equipment component, comprises a plate-like aluminum nitride sintered body having a placement surface on which a substrate is to be placed, an electrode is embedded in the aluminum nitride sintered body.

OOKI K, OKI K

Method for transferring graphene sheet from copper substrate to functional substrate, involves submerging functional substrate in floating bath, and decreasing fluid level of floating bath to lower graphene sheet onto substrate.

HEISE S E, BEDWORTH P V, SWETT J L, SINTON S W

Method for controllable layer-by-layer removal of graphene layer, involves providing layer of graphene, providing highly graphene-oxidizing agent in hermetic environment and providing heating source for heating graphene layer.

CHEN W, HSU W, TENG P, CHIU P, HSU W J, TENG P Y, CHIU P W