国家/地区 美国（7）
IPC部 B（7）
IPC大类 F28（7）
IPC小类 F28F（7） B32B（4） H01L（4）
H05K（4） B82B（2） B82Y（2）
C08J（2） C09K（2） C22C（2）
C23C（2） C25D（2）
IPC F28F021/02（7）
发明人 JANG B Z（2） LIN Y（2） ZHAMU A（2）
公开年 2014（2） 2016（2） 2019（2）
申请年 2014（3）  2018（2） 
专利权人 NANOTEK INST.（2）

Metal matrix nanocomposite used as e.g. load-bearing element, comprises metal or metal alloy containing gold and silver as matrix material, and multiple graphene sheet chosen from pristine graphene material or non-pristine graphene material.

ZHAMU A, LIN Y, JANG B Z

Producing metal matrix nanocomposite by preparing graphene dispersion, bringing the graphene dispersion in physical contact with solid substrate surface, and depositing layer of metal or metal alloy onto surfaces of aligned graphene sheets.

ZHAMU A, LIN Y, JANG B Z

Composite structure comprises organic resin, carbon fiber and flat graphene nanosheets embedded in resin.

LUTZ M, TANZILLI D, BURGER N, LAACHACHI A

Graphene-based thermal management core for printed wiring boards (PWB) used for electronics applications, e.g., consumer electronics, has first or second reinforcement layer which includes substrate impregnated with non-dielectric resin.

SCHNEIDER D, DAVIS W E

Composite material used for thermal-conducting material for thermal management of collagen, comprises metal matrix and graphene platelets dispersed in the metal matrix with random orientation.

KIM N P

Heat-dissipating sheet used for electronic device, consists of metal layer, graphene layer, protective layer, adhesive layer, and release layer in contact with surface of adhesive layer, and has preset thermal conductivity.

LEE M, JEONG H, LEE M H, ZHENG X

Thermal management assembly for transferring heat away from heat source, comprises first substrate, second substrate, bulk graphene material disposed between first and second substrates, and thermal bond layer.

FAN W, LIU X, MARINER J, RAPE A