国家/地区 美国（62）
IPC部 H（62） C（29） B（25）
G（12） F（7） A（2）
IPC大类 H05（62）
IPC小类 H05K（50） H01L（16） H05B（13）
C08K（10） B32B（9） G06F（8）
H01B（8） C01B（7） C08L（6）
C09K（6） C08G（5） C09D（5）
C08J（4） H01F（4） H01Q（4）
IPC H05K009/00（18） H05K007/20（16） H05K001/02（11）
C08K003/04（7） H05B003/14（7） H05K003/00（7）
H05K001/09（6） H05K001/11（6） G06F001/20（5）
H01L023/373（5） H05K001/03（5） B32B009/00（4）
G06F001/16（4） H05K001/18（4） B32B007/12（3）
发明人 AURONGZEB D M（4） KIM Y S（3） CHEN J（2）
CHOI C（2） DELLOCK P K（2） JIMENEZ S D（2）
JIN R（2） PARK J（2） SALTER S C（2）
SHIH P（2） TAN G（2） YOO C H（2）
公开年 2021（27） 2022（27） 2023（8）
申请年 2021（62）
专利权人 DELL PROD LP（4） AT S AUSTRI.（3） AT S AUSTRI.（3） TICONA LLC（3）
AT S AUSTRI.（2） FORD GLOBAL .（2） INTEL CORP（2） MICRON TECHN.（2）
SAMSUNG ELEC.（2）

Solder composition used in solder joints of printed circuit boards, comprises a compound layer comprising an alloy of bismuth and tin, and a graphene coating positioned on the compound layer.

AURONGZEB D M

Flexible heating pad for use in portable electric heater for heating e.g. food items, has flexible circuit provided between first heating fabric and nanotube-based film, and for facilitating increase in temperature by heating fabrics, where nanotube-based film is provided with first surface.

RURS P

Combination of non-conductive polymer, filler and saline for eliminating electrostatic discharges and electromagnetic-interference, and manipulating dielectric constant, comprises filler comprising material selected from aluminum tri-hydrate, calcium carbonate, aluminum nitride and graphene.

PU V D

Preparing and depositing electromagnetic absorber spray foam on electronic equipment, involves providing isocyanate resin selected such that blending the isocyanate resin with the polyol blend results in electromagnetic absorber spray foam.

COCCHINI M, DOYLE M, BENEFIELD S B, CAMPBELL E J, CONNOR S R

Information handling system for thermal management for dense structures, has graphene paint applied to support structure at least where support structure surface faces housing interior, support structure separate from and coupled with housing, support structure having surface facing housing interior.

JIMENEZ S D, AURONGZEB D M, TAN G, NORTH T C, SHIH P

Information handling system comprises housing, circuit board coupled to housing and having ground, processor arranged in housing and interfaced with circuit board, processor operable to execute instructions that process information, memory arranged in housing and interfaced with circuit board.

AURONGZEB D M, SHIH P, JIMENEZ S D, SHAW T C, RAMASAMY S, KIM C, TAN G

Heat dissipation film for use in protective case of e.g. tablet, has heat diffusion layer being sandwiched between plastic base layer and heat absorption layer, where outer layer is attached on side portion of heat absorption layer.

LIN S, LAI K

Portable information handling system docking station for thermal managing liquid metal embedded elastomer, has port coupled with cable to interface external device, and glass material whose piece is coated with graphene and interfaced with processing component to dissipate thermal energy.

AURONGZEB D M, GOH P L, CHOI D

Circuit board structure, has dielectric layer provided on circuit layer, and build-up circuit layer exposing non-conductive seed layer region and electrically connected to pads through conductive via and conductive seed layer region.

CHEN K, KUO C, CHEN G, GUO J

Optimized filling holes comprise modifying insulative inner wall of blind hole with reduced graphene oxide, depositing copper in blind hole through electroplating process, removing first dry film to expose copper foil, and removing exposed copper foil.

YANG N, YEH A