国家/地区 中国（13） 美国（2） 世界知识产权组织（2）
IPC部 C（14） G（2） H（2）
IPC大类 C08（14）
IPC小类 C08L（14） C08K（11） C08J（10）
C09K（8） C08G（5） C09D（5）
C09J（2）
IPC C08L079/08（14）
发明人 WANG W（2） ZHANG Z（2）
公开年 2020（7） 2021（6）
申请年 2020（14）
专利权人

Condensation curable composition for use in cured silicone-imide material for article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane, comprises silicone-imide base polymer, crosslinker, and condensation cure catalyst.

KONWAR D B, FUJIMOTO T, MANDAL S

Preparation of polyimide composite molded plastic used for e.g. electronic appliances, involves hot-molding thermally conductive polyimide composite powder material, mixing with solvent, aromatic diamine and aromatic dibasic acid anhydride, and heat-molding powdery polyimide composite molding powder.

XU G, XUE F, ZHOU J

Aqueous anti-corrosion non-stick coating comprises fluorine resin emulsion, polyamide-imide (PAI) emulsion, anti-corrosion filler, pigment, auxiliary agent, pH regulator and water.

LIU H, QIAN T

Electroplating of metal on surface of insulating base material for printed circuit board, involves mixing resin and solid filler to obtain resin coating, coating conductive substance forming film and placing in plating solution.

LAI Z, LIANG X, ZHAO T, LIU D, SUN R

Electronic skin comprises e.g. encapsulation layer arranged on sensing layer, glue layer arranged on bottom of base layer and release paper arranged on glue layer, base layer and packaging layer are provided with heat dissipation layer.

JIANG Z, LI W

Low-temperature resistant polymer insulating and thermally conductive composite material comprises e.g. high-density polyethylene, micron silicone oil lubricant epoxy resin matrix, curing agent, polypropylene resin and polyimide.

DU C, JIA X, WANG W, YU H, YAN Y

Ultra-thin composite adhesive film comprises graphene heat dissipation layer, substrate layer, first metal layer and colloid layer stacked in sequence, second metal located between graphene heat dissipation layer and substrate layer.

LI L, LIANG C

Polymer chemical material comprises aluminum trichloride hexahydrate, urea, graphene, aromatic dianhydride, aromatic diamine, epoxy resin, curing agent, and dispersant.

LUO C

New modified graphene used for forming modified graphene-resin composite and modified graphene dispersion, has preset ratio of intensity of G band with respect to intensity of D band in Raman spectroscopy spectrum.

WATANABE T, KITAO A, SUZUKI K, KOBAYASHI Y, WATANABE D, KOBAYASHI A

High thermal conductivity graphene modified polyimide porous material comprises diamine functionalized graphene, 3,5-diaminobenzoic acid, dianhydride monomer, acetic anhydride and pyridine.

MEI H