国家/地区 中国（21）
IPC部 C（21）
IPC大类 C08（21）
IPC小类 C08L（18） C08K（16） C08J（7）
C09K（5） C08G（3） C09D（2）
H05K（2）
IPC C08K003/04（11） C08K003/22（5） C08L083/04（5）
C08J005/18（4） C08K003/18（4） C08K007/06（4）
C08L063/00（4） C09K005/14（4） C08K003/26（3）
C08L023/16（3） C08L075/04（3） C08K003/34（2）
C08K007/08（2） C08K007/26（2） C08K009/04（2）
发明人 LI M（21）
公开年 2021（16） 2022（5）
申请年 2021（21）
专利权人 AEROSPACE SP.（3） AEROSPACE RE.（2） SHENZHEN HEI.（2）

Nanocomposite graphene-modified idler antistatic flame-retardant material comprises master batch and ultra-high molecular weight polyethylene, where master batch comprises nanometer superconducting carbon black, high-density polyethylene grafted maleic anhydride, and modified organic montmorillonite.

WU T, QI J, LI M

Wave absorbing glue film comprises wave absorbing layer one or two sides set with reinforcing layer outer side set with adhesive film layer outer side set with backing and absorbing layer film formed by mixing wave absorbing material and resin matrix.

ZHAO H, DU P, LI Y, LV T, LI M

Preparing submicron active heavy calcium carbonate useful in biaxially oriented polypropylene film comprises taking modified grinded calcium carbonate block, crushing to obtain active heavy calcium carbonate dry powder, grinding calcium carbonate powder, adding mixed powder material and stirring.

LI M, LI D, WEN Z, LI S

Thermally conductive filler useful for preparing thermally conductive gel, contains mixture of aluminium oxide and graphene oxide, and is modified by silane modifier.

CHEN Q, ZHOU K, LI M, GU Z

Preparing a porous material comprises e.g. preparing a solution to be frozen, patterning the surface of the cold source to obtain the surface of the cold source with a micro structure, pouring a solution to be frozen into a freezing mold and performing directional freezing.

GAO W, WANG M, ZHAO N, LI M, BAI H

Heat-sensitive synthetic label paper against plasticizers useful for fresh-keeping films, comprises high-quality base paper layer, heat-sensitive discoloration layer and varnish isolation layer sequentially arranged from bottom to top.

LI M

Preparing wave absorbing bismaleimide resin comprises mixing bismaleimide resin, epoxy resin and absorbent in internal mixer, refining, absorbing bismaleimide resin, introducing curing agent and curing at different temperature stage.

LI M, LI Y, LIU P, GONG Y, LV T

Preparation method of wave-absorbing epoxy resin of wave-absorbing epoxy resin composite material, involves banburying and coarse mixing epoxy resin and absorbent, refining, mixing, adding curing agent, triggering and curing wave-absorbing epoxy resin curing system at different temperature stages.

LV T, LI Y, GONG Y, LI M, ZHAO H

Preparation of heat conducting gasket used for electronic products by mixing phase change material, heat conducting filler, matrix material and crosslinking agent, performing curing crosslinking reaction, and freezing preform.

CHU W, JIANG N, LI M, YU J

Preparing co-cured wave-absorbing composite material comprises paving one layer of first prepreg on forming mold, pre-compacting, paving one layer of second prepreg, covering one layer of absorbing adhesive film on the composite material substrate, covering one layer of third prepreg and curing.

GONG Y, YAN L, LI M, LV T, LI Y