国家/地区 世界知识产权组织（23）
IPC部 C（23）
IPC大类 H05（23） C08（14） C09（14）
H01（14） B32（5） C23（3）
G01（3） B05（2） B29（2）
B33（2） B82（2）
IPC小类 H05K（23）
IPC C08K003/04（10） H05K007/20（9） H05K009/00（8）
H05K001/09（5） C08L101/00（4） C09D011/52（4）
C09J011/04（4） H01L023/36（4） B32B009/00（3）
C08J005/04（3） C08J005/18（3） C08K003/013（3）
C08K003/34（3） C08L063/00（3） C09J011/08（3）
发明人 ICHIKAWA I（3） ISAO I（3） TAKEO Y（3）
YOSHINOBU T（3） JIN R（2） KIM Y S（2）
NAITO T（2） SHIRATORI K（2） TSUKADA Y（2）
YAJIMA A（2）
公开年 2022（16） 2021（7）
申请年 2021（23）
专利权人 LINTEC CORP（3） NISSAN MOTOR.（2） TICONA LLC（2）

Thermally conductive film for heat dissipation structure, is formed by arranging binder and scale-like carbon materials formed by graphene layers, and making portion(s) of minor axis of binder and minor axes of spaces formed by carbon materials and binder smaller than minor axis of carbon materials.

NAITO T, TSUKADA Y, KENEKO T, YAJIMA A, SHIRATORI K

Heat conductive film used for head-up display, is configured by disposing scale-like carbon material formed by graphene layers such that adjacent scale-like carbon materials contact each other, and such that major axis of scale-like carbon material is oriented in surface direction of film.

KANEKO T, NAITO T, TSUKADA Y, YAJIMA A, SHIRATORI K

Thermally conductive adhesive composition used in electronic devices, comprises adhesive resin and graphene having two-dimensional structure.

TAKEO Y, ISAO I, YOSHINOBU T, ICHIKAWA I

Method useful for e.g. depositing nanocomposite in e.g. solar application, involves stabilizing reduced graphene oxide with poly(sodium 4-styrenesulfonate), mixing conductive polymer and poly(3,4-ethylenedioxythiophene)-poly(styrene sulfonate) and electropolymerizing obtained solution onto electrode.

WAN SALIM W W A, BENOUDJIT A, SHOHIBUDDIN I U S

Material used for housing for mobile devices, comprises polyetherketoneketone.

JEONG K S, KIM M S, KIM J H, PARK J S, AHN C H, CHO S H, JUNG K S, KIM M, KIMJAEHEON, PARK J, JO S

Composition for forming article e.g. seals, comprises matrix polymer chosen from thermoplastic polymer and curable polymer having functional group for crosslinking, and three-dimensional, branched and/or crosslinked carbon nanostructure additive provided in amount such that after forming article.

REICHL G, GUREVICH E, PERIYASAMY M, QUARTAPELLA C J, PIACENTE N P, LYNN B

Electromagnetic interference shield comprises substrate, metal-based conductive additive, and binder incorporated with metal-based conductive additive and deposited as electromagnetic interference shielding coating on substrate.

ELKADY M F, LANE S, KANER R B, KAVANAUGH J

Composition used in electronic component for shielding electromagnetic waves, comprises silver particles, resin and alkoxysilane compound.

TAKASHI Y, YONEDA T

Patterning method for manufacturing of a desired pattern of an electrically conducting, semiconducting or insulating material on a substrate,.

LEPPAENIEMI J, SNECK A

Adhesive film used in adhesive film with support sheet, comprises thermally conductive filler having two-dimensional crystal structure epoxy component, curing agent, binder polymer and curing agents has pi-conjugated mesogen skeleton.

ISAO I, TAKEO Y, ICHIKAWA I, YOSHINOBU T