国家/地区 美国（15）
IPC部 B（15）
IPC大类 B32（15）
IPC小类 B32B（15） H05K（8） C08K（5）
H01L（4） C08G（3） C08L（3）
H01B（3） C01B（2） C08J（2）
C09D（2） C09J（2） C09K（2）
C23C（2） F28F（2） H05B（2）
IPC B32B009/00（6） B32B007/12（4） H05K007/20（4）
B32B009/04（3） B32B027/28（3） B32B027/36（3）
B32B003/26（2） B32B005/02（2） B32B005/16（2）
B32B015/04（2） B32B015/08（2） B32B027/08（2）
B32B027/18（2） B32B027/20（2） B32B029/00（2）
发明人
公开年 2021（8） 2022（6）
申请年 2021（15）
专利权人

Covering for information handling system, comprises first layer comprising composition containing polylactic acid and glass, and second layer comprising recycled aluminum.

SHEU W, GOH P L, CHEN E, PELISSIER G R, AURONGZEB D M

Thin encapsulating mounting structure for evaporation and heat dissipation applications for electronic component, has specific thin film portion whose one surface is fixed to fixing portion, and preset thin film portion, fixing portion and specific thin film portion that are assembled.

LU J, LUGECHI, LU J Q

Electromagnetic interface (EMI) shielding material comprises polymer matrix and van der Waals material is embedded in polymer matrix, forming quasi-one-dimensional atomic threads, where van der Waals material is trichalcogenide compound.

KARGAR F, BALANDIN A A

Heat dissipation sheet comprises e.g. graphite layer, primary graphene layer stacked on one side of graphite layer with primary adhesive layer interposed there between and secondary graphene layer stacked with secondary adhesive layer.

PARK J, YOUNG C, CHOI C Y, PARK J U, CHOI C, PIAO Z

Thermal conductive structure comprises thermally conductive metal layer, and structural layer arranged on thermally conductive metal layer, where structural layer is stacked structure formed by graphene layer and ceramic material layer or structural layer is graphene-mixed ceramic material layer.

HUANG H, HUANG C, HE M, HANCHANGHUANG, HE M X, HUANG J K, HUANG H Z, WANG H

Adhesion promoting layer for depositing conductive layer on inorganic or organic-inorganic hybrid substrate to form conductive structure, includes metal oxide layer containing metal oxide and chelating agent, arranged on inorganic or organic-inorganic hybrid substrate, and interface layer.

HUANG M, WANG W, CHANG Y

Electromagnetic wave absorption structure comprises electromagnetic wave composite absorbing layer, where electromagnetic wave composite absorbing layer comprises conductive composite layer and insulating layer, and insulating layer is stacked and overlapped with conductive composite layer.

WU F

Graphene heat-conducting gasket wrapping process involves coating layer of colloid around graphene heat conducting gasket, and forming wrapping layer after curing colloid.

ZHOU X, DOU L, HE X, YANG S, SUN A, CAO Y

Coating insulation component in high temperature, high voltage and/or corrosive environments, by applying coating of heat processing composition of crosslinkable aromatic polymer to exterior surface of insulation component and crosslinking.

DRAKE K A, SONG L, GAVLIK R, GABRIEL R

Resin composition used to form dielectric substrate layer and prepreg used to form printed circuit board, comprises polymeric based material and fillers comprising hollow fillers comprising hollow filler, and material of hollow filler is silicon dioxide.

CHANG C, WU Y, ZHANG C