国家/地区 韩国（8） 世界知识产权组织（3）
IPC部 C（8） H（2）
IPC大类 C09（8） C08（6）
IPC小类 C09D（8）
IPC C09D007/61（5） C08K003/04（3） C09D007/40（3）
C09D175/04（3） C09C003/10（2） C09D201/00（2）
发明人 KIM T H（8）
公开年 2022（5） 2023（3）
申请年 2021（8）
专利权人 PUREMANN INC（2）

Environmentally friendly clothing cover comprises cover body forming storage space for storing clothes, hook protruding part of hanger protrudes to outside, and located at upper center of cover body, and clothing entrance.

CHOI W S, KIM Y H, LEEJUNGEUN, KIM T H, LEE D H, JUNGMUG K, LIM J H, HO C I, KIM Y K, KIM J M

Composition used in production of heat-dissipating paint, comprises binder resin comprising urethane resin or epoxy resin, thermally conductive particles comprising expanded graphite particles having preset diameter and metal particles, additives comprising anti-settling agent, and solvent.

HUN L S, SONG J, CHOI S, YUMINSOOK, KIMTAEHAN, LEE S H, SONG J H, CHOI S I, YU M S, KIM T H

Perovskite composite films useful in energy harvesting device, comprises halide perovskite material dispersed in organic matrix composed of natural polymers.

KIM T H, KIM Y J, HUN L

One-component urethane heat dissipation paint composition e.g. for coating heat dissipation coating film, comprises e.g. polyol, thermally conductive particles including graphite, additives, block diisocyanate and acetate-based solvent.

KIMTAEHAN, HUN L S, YOUK S K, YUMINSOOK, KIM T H, LEE S H, YU M S

Complex functional pigments useful in coating composition, comprises titanium oxide airgel doped with noble metals and/or transition metals.

PARK H, KIM Y H, KIM T H, CHOI H R, HOON L J, LEE J, CHOI H, KIM T, KIM Y

Adhesive used in polymer blend composition for bonding several substrates, comprises carrier particles having preset specific surface area and polymer coating agent coated on surface of carrier particles.

MAN C, LEEJONGHWAN, KIM T H, PARK J H

Multi-layered composite material useful for exterior materials e.g. electronic products comprises protective coating layer formed on one or both surfaces of nonwoven substrate comprising polyethylene terephthalate fiber and fiber material.

WOO H G, GANGOK J, HWANG J W, KIM T H, YOUNG K J, KIN H J, BAEK S H

Cooling of semiconductor component for e.g. heat sink, involves arranging metal layer between component and heat dissipation coating layer, forming coating layer by using heat dissipation coating composition containing urethane binder resin, and exfoliating thermally conductive particles.

KIMTAEHAN, HUN L S, CHOI S, SHIM Y, SONG J, KIM T H, LEE S H, CHOI S I, SIM Y H, SONG J H