国家/地区 中国（12）
IPC部 C（12）
IPC大类 C09（12）
IPC小类 C09K（6） C09D（5） C08L（4）
C08J（3） C08K（3） B05D（2）
H05K（2）
IPC C09K005/14（5） C08K003/04（3） C09D011/03（3）
B05D007/24（2） C08K009/00（2） C08L063/00（2）
C09D007/61（2） C09D011/033（2） C09D011/102（2）
C09D011/52（2） C09K005/06（2） H05K007/20（2）
发明人 PAN Z（12）
公开年 2022（10） 2023（2）
申请年 2022（12）
专利权人 ANHUI AEROSP.（10）

Water-blocking material for sealing openings of heat-insulating materials used for preparing structure, comprises components polysiloxane, polyether polyol isocyanate, polyolefin polyol, curing agent, catalyst, defoamer, and filler.

HU B, LIU Y, HE W, NI X, PAN Z, ZHANG S, WANG T

Preparing conductive filler for conductive ink and curved surface heating body, comprises adding carbon nanotubes into polar solvent, and ultrasonically dispersing to obtain carbon nanotube dispersion, and emulsifying graphene and ethanol by emulsifier to obtain emulsion.

ZHOU M, PAN Z, LI L

Preparing conductive ink comprises preparing oligomer containing cholesterol monomer, and taking oligomer as dispersant, adding carbon-based material into non-polar solvent, ultrasonically dispersing and concentrating.

ZHOU M, PAN Z, LI L

Preparing graphene liquid metal composite silica gel pad involves adding graphene oxide and gallium-based alloy liquid metal to water at a certain mass ratio, adding an acid solution and using ultrasonic stirring to obtain a graphene liquid metal aqueous dispersion.

PAN Z, ZHOU M

Method for improving stab resistance of aramid non-woven fabric, involves modifying aqueous polyurethane adhesive using graphene as modifier, dispersing graphene in water or organic solvent, reacting, and gluing aramid fibers.

ZHANG J, FU L, PAN Z, WU Z, LIU Y, CUI Z, LI Z, FANG X, XU D, HU L, CHEN H, AI Q, LI N, DAI J

Preparing high thermal conductivity insulating silica gel, comprises e.g. coating liquid silica gel on both sides of layer of fluorinated graphene membrane, coating liquid silica gel on another layer of fluorinated graphene membrane and curing.

PAN Z, ZHOU M

Preparation of heat-conducting plastic used for heat dissipation of electronic components, involves coating prepared slurry on polyethylene terephthalate film by slit coating machine, and volatilizing solvent to obtain heat-conducting plastic of graphene composite polymer.

PAN Z, ZHOU M

Preparing graphene electrothermal film comprises e.g. coating adhesive on surface of release layer away from graphene conductive layer exposed after peeling off base material to form second adhesive layer, bonding second fiber fabric to second adhesive layer and performing to hot pressing operation.

ZHOU M, PAN Z, LI L

Epoxy resin composite material, has multiple fluorinated graphene films located in epoxy resin base body, where multiple fluorinated graphene films orderly arranged along thickness direction and along length direction of epoxy resin base body.

PAN Z, ZHOU M

Preparing graphene composite thermal conductive film comprises mixing graphene and carbon fibers in organic solvent, orientating in magnetic field, removing organic solvent to obtain graphene-carbon fiber composite film, clamping between mirror-smooth templates and vacuum pressi.

PAN Z, ZHOU M