国家/地区 中国（8）
IPC部 C（8）
IPC大类 C08（8） C09（8）
IPC小类 C08K（8）
IPC C08K003/04（8）
发明人 PAN Z（2） ZHOU M（2）
公开年 2022（6） 2023（2）
申请年 2022（8）
专利权人 ANHUI AEROSP.（2）

Preparing high thermal conductivity and low dielectric epoxy composite material used in electronic packaging field, involves preparing polyimide, dispersing polyimide microspheres and low-dimensional thermally conductive insulating fillers in solvent, mixing polyimide microsphere with epoxy resin.

ZHONG R, LIANG J, CAI H, TU S, HU D

Hollow micro-sphere composition heat-conducting covered filler by low-dimensional nano-high heat-conducting material useful in heat-conducting aspect, comprises nano-high heat-conducting material comprising electrostatic interaction, chemical bond action and solvent hydrogen bond interaction.

LIU T, HUANG X

Epoxy resin composite material, has multiple fluorinated graphene films located in epoxy resin base body, where multiple fluorinated graphene films orderly arranged along thickness direction and along length direction of epoxy resin base body.

PAN Z, ZHOU M

Preparing porous framework with double interlaced network used as heat conductive filler in heat interface material by mixing filler, binder and water, ball milling, placing polytetrafluoroethylene mold on copper column, adding porous framework and filler mixture, filtering, drying and sintering.

XU J, SUN R, ZENG X, YAO Y

Preparing epoxy resin composite thermal conducting sheet useful in the technical field of functional sheet materials, comprises e.g. mixing the fluorinated graphene thermal conducting film, phthalic anhydride and ether, coating the mixed slurry and peeling off epoxy resin composite material layer.

PAN Z, ZHOU M

Preparing graphene composite material with thermal conductivity comprises adding aggregate and solvent to obtain mixture, mixing and stirring to obtain graphene composite slurry and injecting graphene composite slurry into mold to carry out staged heating reaction.

YANG Z

Preparation of shape memory epoxy foam composite material for shape memory plugging agent, involves mixing aqueous dispersion of nano particles with epoxy monomer, stirring to form Pickering emulsion and adding curing agent into pickering emulsion, pouring emulsion into mold, heating and curing.

QIN W, GU L, HE S, MA Q, ZHOU D, WU Y, FENG H, LIU L, XING X, LI Z

Preparing graphene-based alkenyl epoxy resin heat-conducting composite material, involves reacting pyrenyl hyperbranched polyethylene terpolymer, functional assistant, mixing obtained graphene dispersion liquid with epoxy resin, chloroform.

YE H, WANG Q, WANG W, XU L