国家/地区 中国（7）
IPC部 C（7）
IPC大类 C25（7） H05（4） H01（3）
C01（2） C23（2）
IPC小类 C25D（7）
IPC C25D003/38（7）
发明人 LIU Z（2）
公开年 2022（4） 2023（3）
申请年 2022（7）
专利权人

Method for preparing high-conductivity nanometer graphene colloid useful in field of printed circuit board involves mixing nano-graphene material with additive, dissolving in water, and performing ball milling and ultrasonic dispersion treatment.

ZHAO Y, CHAI X, HU C, YANG G

Polypropylene based composite current collector useful in battery of electric device, comprises polypropylene layer, modified layer and metal layer arranged in stack, where modified layer formed by grafting hydroxy-terminated acrylate and layered double metal hydroxide onto polypropylene layer.

ZHANG G, LI X, XIA J, WANG S, ZHU Z

Preparing low transmission loss single crystal copper material comprises e.g. forming single crystal copper layer on substrate i.e. graphene layer surface, and peeling off single crystal copper layer from substrate in mixed gas atmosphere of argon and hydrogen.

WANG E, YUE X, HUANG Z, HE M, ZHANG Z, DING Z

Composite current collector for use in lithium battery field, has electroplating copper layer arranged on two sides of conductive polymer substrate layer, where conductive polymer substrate layer is provided conductive material and polymer substrate.

JIAO X, WANG R, LIU Z, YAN C

Method for preparing composite current collector for lithium battery cathode, involves forming composite base film by bidirectional stretching process of sheet, and forming current collector surface with metal layer by water plating process.

FANG Y, XU X, ZHOU G, LIANG Y, XU H, PAN J

Preparing negative charge oxidation graphene, comprises adding concentrated sulfuric acid in reaction container, adding graphite powder, persulfate and phosphorus oxide, and adding concentrated sulfuric acid into graphite solution.

SONG T, CHEN W, PAN Z, LIU Z

Preparing composite copper graphene involves preparing graphene heat conducting film as base material, performing regular perforation process on surface of base material surface, performing electroplating treatment, performing copper deposition on substrate surface and rolling.

LIN Z, CHEN Q, LIANG H, CAI J