国家/地区 中国（6）
IPC部 F（5）
IPC大类 F25（3） F24（2）
IPC小类 F25B（3）
IPC F25B021/02（3）
发明人 TANG Y（6） YU H（6）
公开年 2015（6）
申请年 2015（6） 
专利权人 TANG Y（6）

Semiconductor heating plate, has power supply unit connected with metal conductor, N-type semiconductor and P-type semiconductor that are connected with graphene unit, and heat radiator formed with heat radiator graphene layer.

TANG Y, YU H

Open cooling device, has power supply unit connected with electrodes, and N-type semiconductor formed with graphene layer, where P-type semiconductor and N-type semiconductor are formed with uniform graphene unit.

TANG Y, YU H

Cooling device, has graphene layer fixed with P-type semiconductor, and heat conductor connected with heat radiating sheet, where P-type semiconductor is connected with N-type semiconductor that is fixed with graphene layer.

TANG Y, YU H

CPU radiating device, has semiconductor refrigerating sheet arranged with N-type semiconductor and P-type semiconductor, where semiconductor refrigerating sheet and N-type and P-type semiconductors are fixed with graphene layer.

TANG Y, YU H

Semiconductor heating device, has P-type semiconductor and N-type semiconductor respectively arranged between heat end part and cold end part, where P-type semiconductor and N-type semiconductor are made of graphene material.

TANG Y, YU H

Semiconductor water heater, has N-type semiconductor and P-type semiconductor provided with uniform graphene, and heating pipe fixed with graphite alkene heat guide part, where heat insulation layer is formed on heating pipe.

TANG Y, YU H