国家/地区 中国（29） 台湾（7） 美国（6） 日本（2） 韩国（2）
IPC部 H（20） C（12） B（8）
A（5） F（3） D（2）
IPC大类 H01（19） C01（5） A61（4）
C08（3） H05（3） A44（2）
B22（2） B82（2） C09（2）
F28（2）
IPC小类 H01M（12） H01B（5） C01B（4）
C08L（3） H01L（3） H05K（3）
A44C（2） A61H（2） A61K（2）
A61M（2） A61N（2） A61P（2）
B22F（2） B82Y（2） C08K（2）
IPC H01M004/62（8） H01M010/0525（7） H01B001/24（3）
H01M004/36（3） H01M004/38（3） H05K007/20（3）
A44C005/00（2） A61H039/00（2） A61H039/06（2）
A61M037/00（2） A61N001/32（2） A61N001/36（2）
A61N005/06（2） C01B032/182（2） C01B032/20（2）
发明人 HUANG C（34）
公开年 2022（19） 2021（14）
申请年 2021（34）
专利权人 CTRON ADVANC.（4） GUANGDONG TR.（2） HUNAN LIFANG.（2） UNIV HUAZHON.（2）
XIAMEN KNANO.（2）

Preparing stretchable electroconductive material for device, involves dissolving poly(3,4-ethylenedioxythiophene) polystyrene sulfonate in water to form first mixed solution, and adding repair linking agent and ionic liquid plasticizer sequentially to form second mixed solution.

HUANG C, CHUNG S, HUANG Q, ZHONG S

Heat dissipation structure for electronic device e.g. mobile phone, has heat dissipation module whose side protrudes from top surface of heat generating element, and does not contact with surface of carrier.

HE M, HUANG H, HUANG C

Nanogel for preventing or treating disease or condition susceptible to amelioration by anticoagulant or antioxidant for e.g. thrombophilia, vascular thrombosis, comprises graphene-like nanosheet and polysaccharide.

LIN H, HUANG C, MAO J, WANG C, HUANG Z

Heat dissipation structure for use in electronic device, has heat dissipation module placed on surface of carrier, and including covering heating element, where setting position of module corresponds to heating element.

HE M, HUANG H, HUANG C

Thermal conductive structure comprises thermally conductive metal layer, and structural layer arranged on thermally conductive metal layer, where structural layer is stacked structure formed by graphene layer and ceramic material layer or structural layer is graphene-mixed ceramic material layer.

HUANG H, HUANG C, HE M, HANCHANGHUANG, HE M X, HUANG J K, HUANG H Z, WANG H

Key structure for keyboard of e.g. personal desktop computer and notebook computer, comprises first electrode, key cap arranged on first electrode and restoration member arranged between key cap and first electrode, where key cap or restoration member has second electrode to generate sensing signal.

CHUANG W, HSIAO C, LU T, LEE J, WU C H, YEN M, HUANG C, ZHUANG W, XIAO J, LV D, WU Z, YAN M, HUANG J

High heat-resistant aluminum alloy plate, has plate main body whose back surface is provided with multiple mounting holes uniformly distributed between two second fixing seats, where inner part of each mounting hole is equipped with graphene rod.

WU H, TANG S, QIAN Z, HUANG C, LI J

Heat dissipation structure for electronic device, has heat dissipation coating including filler and bonded unit, where filling unit is mixed in bonded unit and filling unit includes graphene, carbon nanotubes, boron nitride and/or silicon carbide.

HE M, HUANG H, HUANG C

Electrolyte for organic nickel ion battery, comprises soluble nickel salt and organic ether solvent.

HUANG C, CHEN S, ZHAO Y

Preparing polyvinylidene fluoride/graphene composite material comprises preparing graphene/vinylidene fluoride monomer mixed solution, mixing mixed solution, deionized water, emulsifier and pH regulator, introducing vinylidene fluoride gas monomer, polymerizing, and adding demulsifier to emulsion.

SUN D, ZHUANG C, WANG Y, LIN J, HUANG C, LIN L, FANG C, HUANG W, HONG J