国家/地区 日本（7） 世界知识产权组织（5）
IPC部 C（6） H（5） G（2）
IPC大类 C01（4） C22（3） H01（3）
G01（2） H04（2）
IPC小类 C01B（4） C22C（3） C22F（2）
G01N（2） H01L（2） H04R（2）
IPC C01B031/02（4） C22C009/00（3） C22C009/02（2）
C22F001/00（2） C22F001/08（2） G01N027/414（2）
H04R001/00（2） H04R017/00（2） H04R031/00（2）
发明人 ONO T（9）
公开年 2013（3） 2023（2）
申请年 2022（3）  2011（2）  2012（2） 
专利权人 JX NIPPON MI.（2） MITSUBISHI P.（2） MURATA MFG C.（2） NIPPON MININ.（2）
TOKYO OHKA K.（2） UNIV KANAGAW.（2） UNIV OSAKA（2）

Acoustic matching layer used for ultrasonic diagnostic apparatus and ultrasonic image inspection apparatus, comprises amorphous carbon, carbon particles dispersed in amorphous carbon, and particles having higher density than amorphous carbon.

OHNO T, SATAKE A, ONO T

Acoustic matching layer of ultrasonic diagnostic apparatus, has amorphous carbon and carbon particles that are dispersed in amorphous carbon such that content of carbon particles is specific value or less to total mass of acoustic matching layer.

OHNO T, SATAKE A, ONO T

Biosensor such as biosensor of FET type, has recognition moiety whose one end is bound to one base moiety and other end is constituted to tip portion of probe molecule, where other base moiety is provided on reference sensor.

SUZUKI Y, USHIBA S, MIYAKAWA N, ONO T, MATSUMOTO K

Graphene transistor has charge donator that is arranged on main surface of graphene layer, and is provided with impurity electric charge, and counter ions whose impurity electric charge is provided with code different from electric charge.

MIYAKAWA N, SHINAGAWA A, USHIBA S, KIMURA M, MATSUMOTO K, ONO T

Copper thermal radiation material used during manufacturing of e.g. electronic component, has graphene layer that is provided on copper foil or copper alloy foil with thickness of specific range.

ONO T, KAMMURI K

Manufacture of graphene substrate used in manufacture of semiconductor chip mounted in e.g. digital audio-video equipment, involves printing pattern of graphene carbon source on substrate, and forming graphene layer.

ONO T, WATANABE M, KINOSHITA Y, KOIDE Y

Manufacture of graphene substrate for semiconductor chip involves electrolytically polymerizing graphene carbon source on electroconductive or semiconductor substrate and forming graphene layer.

ONO T, WATANABE M, KOIDE Y

Copper foil used for manufacturing graphene, comprises copper with specific purity.

CHIBA Y, ONO T, CHIBA G

Copper foil for manufacturing graphene for e.g. separator of fuel cell, comprises copper having specified purity.

ONO T, CHIBA Y